公开(公告)号：EP3322268A4

公开(公告)日：2018-07-25

申请号：EP16821362

申请日：2016-07-04

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： TOMIZAWA KATSUYA ,  TAKAHASHI HIROSHI ,  SHIGA EISUKE

IPC分类号： H05K3/38 ,  C08G73/00 ,  C08J5/24 ,  C08K5/541 ,  C08L35/00 ,  C08L101/00 ,  C09D179/08 ,  H05K1/03

CPC分类号： C08L79/085 ,  C08G73/00 ,  C08G73/128 ,  C08J5/24 ,  C08J7/12 ,  C08J2379/08 ,  C08J2465/00 ,  C08K3/36 ,  C08K5/541 ,  C08K7/18 ,  C08L35/00 ,  C08L101/00 ,  C08L2203/20 ,  C09D179/085 ,  C25D3/38 ,  H05K1/03 ,  H05K1/0373 ,  H05K3/181 ,  H05K3/188 ,  H05K3/38 ,  H05K3/389 ,  H05K2201/0162 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/0786 ,  C08K5/5425 ,  C08L61/14

摘要： It is intended to provide a method for producing a printed circuit board capable of enhancing the adhesion between the inorganic filler-containing insulating layer and the conductor layer of a printed circuit board. The method for producing a printed circuit board of the present invention is a method for producing a printed circuit board, having an alkali treatment step of bringing a surface of an insulating layer for a printed circuit board into contact with an aqueous alkali solution, and a conductor layer forming step of forming a conductor layer on at least a part of the surface of the insulating layer that has undergone the alkali treatment step, wherein the insulating layer contains a resin composition containing a thermosetting resin, a silane compound having a (meth)acrylic skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

公开(公告)号：EP2984912A4

公开(公告)日：2017-01-25

申请号：EP14782216

申请日：2014-04-11

申请人： UNIV ILLINOIS

发明人： ROGERS JOHN A ,  LEE CHI HWAN ,  YIN LAN ,  HUANG XIAN ,  LEAL CECILIA MARIA DAS NEVES BARBOSA ,  HARBURG DANIEL VINCENT

IPC分类号： H05K7/00 ,  A61B5/00 ,  A61M5/44 ,  G06K19/077 ,  H01L21/70 ,  H01L23/00 ,  H01L23/06 ,  H05K1/02 ,  H05K1/03 ,  H05K3/22 ,  H05K3/28

CPC分类号： H05K1/185 ,  A61B5/686 ,  A61B2562/125 ,  A61M5/44 ,  G06K19/0775 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/31111 ,  H01L21/31133 ,  H01L21/56 ,  H01L23/291 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/49894 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/0275 ,  H05K1/0286 ,  H05K1/0306 ,  H05K3/22 ,  H05K3/285 ,  H05K3/287 ,  H05K3/288 ,  H05K5/069 ,  H05K13/0023 ,  H05K2201/10151 ,  H05K2201/10196 ,  H05K2201/10212 ,  H05K2203/0271 ,  H05K2203/0292 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/0786 ,  H05K2203/17 ,  H05K2203/175 ,  H05K2203/178 ,  Y10T29/49124 ,  Y10T137/0318 ,  Y10T428/239 ,  H01L2924/00

摘要： The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

公开(公告)号：EP2529395A4

公开(公告)日：2015-05-06

申请号：EP10844919

申请日：2010-11-10

申请人： MACDERMID ACUMEN INC

发明人： HAMILTON ROBERT ,  LONG ERNEST ,  KROL ANDREW M

IPC分类号： H01L21/4763 ,  B05D3/06 ,  C23C18/16 ,  C23C18/20 ,  C23C18/38 ,  H01L21/44 ,  H01L23/04 ,  H05K3/18

CPC分类号： B05D3/06 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/38 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0786 ,  H05K2203/107 ,  H05K2203/122

摘要： A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

公开(公告)号：EP2276586B1

公开(公告)日：2012-08-29

申请号：EP09729889.7

申请日：2009-02-18

申请人： Dow Global Technologies LLC

发明人： GEISSLER, Konrad ,  KUEMIN, Marius

IPC分类号： B08B3/00 ,  B08B7/00

CPC分类号： B08B3/00 ,  B08B7/00 ,  B08B2230/01 ,  H05K3/26 ,  H05K2203/0783 ,  H05K2203/0786 ,  H05K2203/088

公开(公告)号：EP2411559A1

公开(公告)日：2012-02-01

申请号：EP10756520.2

申请日：2010-02-09

申请人： MacDermid Acumen, Inc.

发明人： FENG, Kesheng ,  KAPADIA, Nilesh ,  PAW, Witold

IPC分类号： C23C22/05

CPC分类号： C23C22/52 ,  C09D5/12 ,  C23C22/83 ,  H05K3/282 ,  H05K2203/0786 ,  H05K2203/124 ,  Y10T428/24917

摘要： A process is described for treating metal surfaces printed wiring boards and similar substrates to provide improved creep corrosion resistance on such surfaces. A modified organic solderability preservative composition is used in combination with an emulsion polymer to provide a modified polymer coating on the metal surface finish via a chemical reaction to provide enhanced corrosion protection of the surface.

公开(公告)号：EP2276586A1

公开(公告)日：2011-01-26

申请号：EP09729889.7

申请日：2009-02-18

申请人： Dow Global Technologies Inc.

发明人： GEISSLER, Konrad ,  KUEMIN, Marius

IPC分类号： B08B3/00 ,  B08B7/00

CPC分类号： B08B3/00 ,  B08B7/00 ,  B08B2230/01 ,  H05K3/26 ,  H05K2203/0783 ,  H05K2203/0786 ,  H05K2203/088

摘要： A method of cleaning at least one article having a surface to be cleaned, the method comprising the steps of inserting the article into a cleaning chamber (3), subjecting the surface of the article to treatment with water vapour under conditions such that at least a portion of the water vapour condenses on said surface of the article as condensed water, and introducing an organic solvent into the cleaning chamber (3) and thereby removing the condensed water from the surface of the article, wherein no immersion of the article in water or agueous solution takes place in the cleaning chamber.

公开(公告)号：EP1187516B1

公开(公告)日：2010-07-14

申请号：EP01307502.3

申请日：2001-09-04

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Eziri, Mitsuo, c/o Mitsubishi Gas Chemical Co.,Inc ,  Komatsu, Shinya, Mitsubishi Gas Chemical Co.,Inc ,  Taguchi, Masaru, Mitsubishi Gas Chemical Co.,Inc ,  Nagai, Norio, c/o Mitsubishi Gas Chemical Co.,Inc

IPC分类号： H05K3/00 ,  B23B35/00 ,  B23Q11/10

CPC分类号： H05K3/0047 ,  B23Q11/10 ,  H05K2201/0212 ,  H05K2203/0152 ,  H05K2203/0214 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T408/03 ,  Y10T408/561

公开(公告)号：EP2096648A1

公开(公告)日：2009-09-02

申请号：EP07851093.0

申请日：2007-12-21

申请人： FUJIFILM Corporation

发明人： TOKUNAGA, Tsukasa

IPC分类号： H01B13/00 ,  G03C1/00 ,  H01B5/14 ,  H05K9/00

CPC分类号： H05K3/22 ,  H05K1/095 ,  H05K3/106 ,  H05K9/0096 ,  H05K2203/0786 ,  H05K2203/088 ,  Y10T29/49155

摘要： A method for producing a conductive film, having the steps: forming, on a support, a conductive metal portion containing a conductive material and a binder; bringing the conductive metal portion into contact with vapor or a hot water; and immersing the conductive metal portion into hot water having a temperature of 40°C or higher.

摘要翻译： 一种导电膜的制造方法，其特征在于，具有以下工序：在载体上形成含有导电性材料和粘合剂的导电性金属部分; 使导电金属部分与蒸气或热水接触; 并将导电金属部分浸入温度为40℃以上的热水中。

公开(公告)号：EP1646270A4

公开(公告)日：2009-07-15

申请号：EP04747136

申请日：2004-06-30

申请人： NIPPON MEKTRON KK

发明人： TANAKA HIDEAKI ,  SENSUI NOBUYUKI

IPC分类号： H05K3/28 ,  H05K3/00 ,  H05K3/26 ,  H05K3/46

CPC分类号： H05K3/0023 ,  H05K3/26 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2203/0786 ,  H05K2203/0793 ,  Y10T29/49126 ,  Y10T29/49155

摘要： In the case of using a photosensitive insulating resin for a surface protective layer of a circuit wiring pattern, or for an insulating layer between circuit wiring conductor layers in a circuit board, Na ions adsorbed on the photosensitive insulating resin are replaced with a polyvalent metal through a treatment step containing Na ions which is executed after a heat curing step of the photosensitive insulating resin. For the polyvalent metal, a II group including Mg or Ca can be selected.

公开(公告)号：EP1914286A4

公开(公告)日：2009-07-01

申请号：EP06782286

申请日：2006-08-03

申请人： ASAHI GLASS CO LTD ,  AGC SEIMI CHEMICAL CO LTD

发明人： KAMIYA HIROYUKI ,  TSUGITA KATSUYUKI

IPC分类号： C09K3/14 ,  C09G1/02 ,  H05K3/26

CPC分类号： H05K3/045 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/3212 ,  H05K3/107 ,  H05K3/26 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/0786

摘要： Disclosed is a polishing composition containing abrasive grains, an oxidizing agent, an electrolyte and an aqueous medium. This polishing composition is characterized in that ions produced from the electrolyte are composed of ammonium ions, at least one kind of organic carboxylate ions selected from the group consisting of polyvalent carboxylate ions and hydroxycarboxylate ions, and at least one kind of ions selected from the group consisting of carbonate ions, hydrogen carbonate ions, sulfate ions and acetate ions. After forming a wiring groove (2) in a resin substrate (1) and burying a wiring metal (3) in the wiring groove (2), the wiring metal (3) is polished by using the above-described polishing composition. Consequently, generation of scratches on the resin substrate (1) and the metal wiring (3) is kept to a minimum, while having a high polishing rate and improving the throughput.

摘要翻译： 公开了含有磨粒，氧化剂，电解质和水性介质的抛光组合物。 该抛光组合物的特征在于由电解质产生的离子由铵离子，至少一种选自多价羧酸根离子和羟基羧酸根离子的有机羧酸根离子和至少一种选自 由碳酸根离子，碳酸氢根离子，硫酸根离子和乙酸根离子组成。 在树脂基板（1）上形成配线槽（2）并在配线槽（2）内埋入配线金属（3）之后，使用上述研磨用组合物对配线金属（3）进行研磨。 因此，树脂基板（1）和金属布线（3）上的划痕的产生被保持为最小，同时具有高抛光速率并且提高了产量。