公开(公告)号：EP0647871A1

公开(公告)日：1995-04-12

申请号：EP94114591.4

申请日：1994-09-16

申请人： SHINTO PAINT COMPANY, LIMITED

发明人： Miyazaki, Susumu ,  Nakano, Tsuyoshi ,  Okada, Yoshikatsu ,  Yasukawa, Jun-ichi ,  Matsumura, Miki ,  Tsueda, Kazuo

IPC分类号： G02F1/1335

CPC分类号： G03F7/2022 ,  G02F1/133512 ,  H05K3/0082 ,  H05K3/244

摘要： A method for manufacturing a substrate having electrically conductive circuits on the surface of a transparent substrate, window-shaped coating films on the electrically conductive circuits and a frame-shaped, functional coating film at the regions not occupied with the window-shaped coating films, includes the steps of:

(a) coating the surface of a transparent substrate with a photoresist composition to cover the circuits-carrying surface of the substrate, followed by forming a photoresist coating film,
(b) superposing a photomask on the surface of the photoresist coating film formed through step (a) and exposing the thus masked photoresist coating film to light,
(c) subjecting the substrate formed through steps (a) and (b) to development, and eliminating the photoresist coating film in the frame-shaped part,
(d) subjecting the photoresist coating film left in step (c) to heat-treatment,
(e) coating the substrate obtained through steps (a) to (d) in this order with a negative photoresist composition containing a function-imparting additive to cover the circuits-carrying surface of the substrate, followed by forming a functional coating film,
(f) exposing the substrate obtained through steps (a) to (e) in this order to light emitted from the opposite side of the circuits-carrying surface of the substrate,
(g) subjecting the substrate obtained through steps (a) through (f) in this order to development, and eliminating the uncured part of the functional coating film,
(h) eliminating the photoresist coating film having been heat-treated in step (d), and
(i) subjecting the substrate obtained through steps (a) to (h) in this order to electro-deposition using the circuits on the substrate as one electrode, and forming electro-deposition coating films at the window-shaped parts on the circuits.

摘要翻译： 一种用于制造具有一个透明基板的表面上的导电性的电路的基板的方法，在所述导电电路和框状的，功能性涂层电影窗状涂膜在区域不与窗状涂膜占据， 包括以下步骤：（a）用一个光致抗蚀剂组合物的透明基材的表面上以覆盖基片的电路-承载表面上，随后通过形成光致抗蚀剂涂层的电影，（b）该光致抗蚀剂的表面上重叠的光掩模 皮膜形成通过步骤（a）并暴露使通过步骤（a）和（b），以显影形成的基板这样掩蔽光致抗蚀剂涂布膜 - 光，（c）和消除光致抗蚀剂涂膜中的框状部 ，（d）使留在步骤（c）光致抗蚀剂涂布膜进行加热处理，（e）与一个负photores涂覆以该顺序通过步骤（A）获得至（d）的基片 是组合物包含函数赋予添加剂，以覆盖基片的电路-承载表面上，随后通过形成功能性涂层电影，（F）暴露通过步骤（A）获得至（e）的基片以该顺序从发射光 基板的电路-承载面的相反侧，（G）使通过工序（a）到（f）中获得的顺序发展基板，消除该功能性涂层电影的未固化的部分，（H）消除 具有薄膜是光致抗蚀剂涂层进行热处理在步骤（d），和（i）使以该顺序通过步骤（A）获得至（h）的基片使用在衬底上作为一个电极的电路，以电沉积，和 形成在上的电路中的窗状部件电沉积涂膜。