Regulation of the plating solution in a plating bath
    2.
    发明公开
    Regulation of the plating solution in a plating bath 无效
    在电镀液电镀液的调节。

    公开(公告)号:EP0043893A1

    公开(公告)日:1982-01-20

    申请号:EP81102879.4

    申请日:1981-04-15

    CPC classification number: C25D21/14 G01N21/8507

    Abstract: Apparatus for regulating the concentration of plating solution (20) components in a plating bath comprising a sensing device (22) suspended in the bath responsive to the concentration of one or more plating components of the plating solution and capable of generating a signal and a pump for supplying replenisher solution to the bath, maintaining the concentration of components of the plating solution substantially constant during use of the plating bath.

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