公开(公告)号：EP0460397A1

公开(公告)日：1991-12-11

申请号：EP91107013.4

申请日：1991-04-30

Applicant: SHIPLEY COMPANY INC.

Inventor： Iantosca, Richard, A.

IPC: C23C18/48

CPC classification number: C23C18/48 ,  H05K3/3473

Abstract: An acid solution for displacement plating of a reflowable tin lead alloy having a melting point not exceeding 500 o F over a cupreous surface. The displacement plating solution contains stannous ions in an amount of from 0.05 to 0.50 moles per liter, plumbous ions in an amount of from 0.01 to 0.15 moles per liter, a total content of stannous ions and plumbous ions in an amount of from 0.05 to 0.60 moles per liter and a ratio of stannous ions to plumbous ions varying from about 1.0:3.0 to 50.0:1.0. The solution is characterized by an ability to plate the tin lead alloy at a plating rate of at least 100 microinches per 15 minutes. The deposit obtained is capable of reflow and is useful in the manufacture of printed circuit boards.

Abstract translation: 在铜表面上具有熔点不超过500°F的可回流锡铅合金的位移镀的酸溶液。 位移镀溶液含有0.05至0.50摩尔/升的亚锡离子，每升0.01至0.15摩尔/升的铅离子，亚锡离子和铅离子的总含量为0.05至0.60 摩尔每升，亚锡离子与铅离子的比例从约1.0：3.0至50.0：1.0变化。 该溶液的特征在于以每15分钟至少100微英寸的电镀速率镀锡锡铅合金的能力。 获得的沉积物能够回流，并且可用于制造印刷电路板。