公开(公告)号：EP0027603A1

公开(公告)日：1981-04-29

申请号：EP80106133.4

申请日：1980-10-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Oddi, Michael J. ,  Orio, Alfred P.

IPC: H05K3/06

CPC classification number: H05K3/28 ,  G03F7/16 ,  H05K3/064 ,  H05K3/108 ,  H05K3/1216 ,  H05K2203/0759 ,  Y10S430/136

Abstract: This invention is directed to processes for using a light sensitive photoresist material in the manufacture of an article having a surface permanently modified in an image pattern. The process comprises applying the photoresist to a substrate through a screen, preferably as a continuous, incompletely imaged layer and thereafter, imaging and developing to provide a relief image in the photoresist layer and treating the substrate to provide a permanent image in the finished article. The process is particularly useful in the manufacture of printed circuits. The process is believed to be a departure from conventional processes in the step of screening a light sensitive photoresist material over a substrate.

公开(公告)号：EP0027603B1

公开(公告)日：1984-05-23

申请号：EP80106133.4

申请日：1980-10-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Oddi, Michael J. ,  Orio, Alfred P.

IPC: H05K3/06

CPC classification number: H05K3/28 ,  G03F7/16 ,  H05K3/064 ,  H05K3/108 ,  H05K3/1216 ,  H05K2203/0759 ,  Y10S430/136