公开(公告)号：EP0505894A1

公开(公告)日：1992-09-30

申请号：EP92104580.3

申请日：1992-03-17

Applicant: SHIPLEY COMPANY INC.

Inventor： Sandock, Leonard Richard

IPC: G03F7/16 ,  B05B15/02 ,  B05C5/02

CPC classification number: B05C9/04 ,  B05C5/0254 ,  B05C5/0262 ,  B05C9/14 ,  B05C11/1039 ,  G03F7/16 ,  H05K3/0091 ,  H05K2203/1518 ,  H05K2203/1572 ,  H05K2203/159

Abstract: Processes and apparatus for uniformly coating discrete substrates by application of a controlled volume of fluid per unit surface area of a substrate. In one aspect, the invention provides a process comprising providing a fluid reservoir; and flowing fluid from the fluid reservoir without substantial interruption through one or more fluid applicators, the fluid applied with a controlled volume per unit surface area of the substrate. The invention also provides processes for applying fluid on a discrete substrate by upwardly or laterally flowing the fluid onto the substrate, and processes for applying fluid onto at least two sides of a discrete substrate. The invention further provides fluid application apparatus which enable application of a uniform fluid layer, including apparatus that provides termination of fluid flow without fluid dripping or trailing of fluid.

Abstract translation: 通过在衬底的每单位表面积上施加受控体积的流体来均匀地涂覆离散衬底的方法和设备。 一方面，本发明提供一种方法，包括提供流体储存器; 并且通过一个或多个流体施加器从流体储存器流动流体而没有实质的中断，所述流体以基板的每单位表面积施加受控的体积。 本发明还提供了通过将流体向上或横向流动到衬底上而在离散衬底上施加流体的方法，以及将流体施加到离散衬底的至少两侧上的过程。 本发明进一步提供了能够应用均匀流体层的流体施加装置，包括提供流体流动终止而不流体流体滴落或拖尾的装置。