公开(公告)号：EP0890991A2

公开(公告)日：1999-01-13

申请号：EP98305131.9

申请日：1998-06-29

申请人： SIEMENS AKTIENGESELLSCHAFT ,  International Business Machines Corporation

发明人： Kluwe, Andreas ,  Prein, Frank ,  Liebmann, Lars ,  Zell, Thomas

IPC分类号： H01L27/02

CPC分类号： H01L23/528 ,  H01L2924/0002 ,  Y10S438/926 ,  H01L2924/00

摘要： In preparation for etch processing a semiconductor chip having areas of little or no pattern and areas that are heavily patterned, adding non-operative patterns to the areas having little or no pattern so that the overall pattern density is about the same across the chip.

公开(公告)号：EP0890991A3

公开(公告)日：2000-05-10

申请号：EP98305131.9

申请日：1998-06-29

申请人： SIEMENS AKTIENGESELLSCHAFT ,  International Business Machines Corporation

发明人： Kluwe, Andreas ,  Prein, Frank ,  Liebmann, Lars ,  Zell, Thomas

IPC分类号： H01L27/02

CPC分类号： H01L23/528 ,  H01L2924/0002 ,  Y10S438/926 ,  H01L2924/00

摘要： In preparation for etch processing a semiconductor chip having areas of little or no pattern and areas that are heavily patterned, adding non-operative patterns to the areas having little or no pattern so that the overall pattern density is about the same across the chip.

摘要翻译： 为了准备蚀刻处理，具有很少或没有图案的区域的半导体芯片和高度图案化的区域，将非操作图案添加到具有很少或没有图案的区域，使得芯片的整体图案密度大致相同。