公开(公告)号：EP2330599A2

公开(公告)日：2011-06-08

申请号：EP09810230.4

申请日：2009-08-28

申请人： SSCP Co., Ltd.

发明人： KIM, Joo Ho ,  KIM, Hwa Joong ,  KIM, In Chul

IPC分类号： H01B1/20

CPC分类号： H01B1/20 ,  C09D11/033 ,  C09D11/102 ,  C09D11/52

摘要： The present invention relates to a conductive paste composition. The conductive paste composition includes a binder resin including a urethane group present in a main chain or a side chain, especially a binder resin formed from isocyanate and a polymer with at least one hydroxyl group, a fine powder, a glass frit, and a solvent. The conductive paste composition can have a superior physical property, improve productivity and an environmental problem by reducing waste fluid such as aqueous alkaline solution, and form a fine pattern having an improved structure. Accordingly, the paste composition is especially useful for a paste for gravure offset printing.

摘要翻译： 本发明涉及一种导电糊组合物。 导电性糊剂组合物包括粘合剂树脂，其包含存在于主链或侧链中的氨基甲酸酯基团，特别是由异氰酸酯形成的粘合剂树脂和具有至少一个羟基的聚合物，细粉末，玻璃料和溶剂 。 导电性糊剂组合物可以通过减少诸如碱性水溶液的废液，具有优异的物理性能，提高生产率和环境问题，并形成具有改进结构的精细图案。 因此，糊剂组合物对于凹版胶版印刷用糊剂特别有用。