-
公开(公告)号：EP3780009B1
公开(公告)日：2024-09-25
申请号：EP19784297.4
申请日：2019-04-10
IPC分类号： H01B1/20 , C08G73/02 , C08K5/3415 , C08K5/3465 , C08L39/06 , C08L79/00 , C09D5/24 , C09D7/63 , C09D201/02 , H01B1/12 , B32B27/28
CPC分类号： C08K5/3415 , C08L39/06 , C09D5/24 , C09D7/63 , C09D201/02 , C08G73/0266 , C08L79/02 , C09D179/02 , H01B1/128 , H01B1/124
-
公开(公告)号：EP4372766A3
公开(公告)日：2024-08-28
申请号：EP24165354.2
申请日：2021-04-21
发明人： CHUNG, Chia-Chun , COX, Jason , MCCARTHY, Kristina , MULHERIN, Kristen , NGUYEN, Jimmy , REIN, Michael , HENG, Tong
IPC分类号： D01D5/00 , B29C51/00 , H01B1/14 , H01B1/20 , B29C70/88 , H01B13/14 , B21C37/04 , D02G3/12 , D02G3/44 , D04C1/02 , A41D1/00 , B21C1/00
CPC分类号： D01D5/00 , B29C70/882 , D02G3/441 , D04C1/02 , B21C37/042 , D02G3/12 , A41D1/005 , B21C1/003 , B21C37/045
摘要： Methods of manufacturing multi-material fibers having one or more electrically-connectable devices disposed therein are described. In certain instances, the methods include the steps of: positioning the electrically-connectable device(s) within a corresponding pocket provided in a preform material; positioning a first electrical conductor longitudinally within a first conduit provided in the preform material; and drawing the multi-material fiber by causing the preform material to flow, such that the first electrical conductor extends within the multi-material fiber along a longitudinal axis thereof and makes an electrical contact with a first electrode located on each electrically-connectable device. A metallurgical bond may be formed between the first electrical conductor and the first electrode while drawing the multi-material fiber and/or, after drawing the multi-material fiber, the first electrical conductor may be located substantially along a neutral axis of the multi-material fiber.
-
公开(公告)号：EP4364536A1
公开(公告)日：2024-05-08
申请号：EP21790901.9
申请日：2021-10-13
申请人： Wacker Chemie AG
CPC分类号： H05K1/095 , H01B1/24 , H05K2201/032920130101 , H05K3/1241
-
-
公开(公告)号：EP3447189B1
公开(公告)日：2024-02-28
申请号：EP17785805.7
申请日：2017-03-30
发明人： NAGAI, Noriko , TAKEDA, Keiji , KAWAKAMI, Jun , NAGATA, Hiroshi , OHORI,Tatsuya
IPC分类号： A61B5/25 , A61B5/291 , C08G63/183 , H01B1/12 , D06M15/227 , D06M15/233 , D06M15/63 , D06M23/08 , H01B1/20 , C08G63/688 , C08L77/00
-
公开(公告)号：EP3407363B1
公开(公告)日：2023-10-25
申请号：EP17741296.2
申请日：2017-01-13
IPC分类号： H01B1/12 , H01B1/06 , H01B13/00 , H01M10/0562 , H01B1/20
-
公开(公告)号：EP4139510A1
公开(公告)日：2023-03-01
申请号：EP21725619.7
申请日：2021-04-21
-
公开(公告)号：EP4134388A1
公开(公告)日：2023-02-15
申请号：EP21783683.2
申请日：2021-03-24
IPC分类号： C08G61/12 , C08G73/02 , C08F212/14 , C08F220/22 , C08F220/38 , C08L25/18 , C08L33/14 , C08L65/00 , C08L101/12 , H01B1/12 , H01B1/20 , H01B5/14
摘要： The present invention is a conductive polymer composition containing: a composite containing a n-conjugated polymer (A) and a polymer (B) shown by the following general formula (2); H 2 O (D) for dispersing the composite; and a water-soluble organic solvent (C). This provides a composition which has favorable filterability and film formability, and which is capable of relieving acidity and forming a conductive film with high transparency. Moreover, since the H 2 O dispersion of the conductive polymer compound is mixed with an organic solvent, the surface tension and the contact angle are so low that leveling property on a substrate is imparted. The composition is usable in droplet-coating methods. Since an organic solvent having a higher boiling point than H 2 O is used as the organic solvent, the composition can avoid solid content precipitation around a nozzle and solid content precipitation due to drying between ejecting the liquid material from a nozzle tip and landing on a substrate.
-
-
公开(公告)号：EP2476732B1
公开(公告)日：2022-11-02
申请号：EP10813529.4
申请日：2010-09-07
-
-
-
-
-
-
-
-
-
搜索结果
935 条记录 (耗时 0.025 秒)
