公开(公告)号：EP2608258A1

公开(公告)日：2013-06-26

申请号：EP11306705.2

申请日：2011-12-20

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Riviere, Jean-Michel ,  Saxod, Karine

IPC: H01L23/433

CPC classification number: H05K7/20 ,  G01F1/20 ,  H01L23/34 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20436 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/1316 ,  H01L2924/00

Abstract: The invention concerns an electronic component package comprising a support and heat conductor 3 the heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.

Abstract translation: 本发明涉及一种包括支架和导热体3的电子部件包装，导热体具有突起，并且支架具有布置成能够接收突起的插座，使得在组装过程期间导热体相对于支架的移动是 降低。