公开(公告)号：EP1571706B1

公开(公告)日：2018-09-12

申请号：EP03811481.5

申请日：2003-06-20

Applicant: Hitachi, Ltd.

Inventor： YOKOZUKA, Takehide, c/o Hitachi, Ltd. ,  HARADA, Masahide, c/o Hitachi, Ltd. ,  YAMASHITA, Shiro, c/o Hitachi, Ltd. ,  UCHIYAMA, Kaoru, c/o Hitachi, Ltd. ,  EGUCHI, Shuji, c/o Hitachi, Ltd. ,  ASANO, Masahiko, c/o Hitachi, Ltd. ,  SATO, Koji, c/o Automotive Systems, Hitachi, Ltd.

IPC: H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/34 ,  H05K3/46 ,  H01L23/00

CPC classification number: H05K1/021 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/4608 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.

公开(公告)号：EP2251903B1

公开(公告)日：2017-03-29

申请号：EP09305435.1

申请日：2009-05-14

Applicant: Thompson Licensing

Inventor： Kiew, Kian Choy ,  Shi, Ji Wei ,  Huang, Wen Xin

IPC: H01L23/40

CPC classification number: H01L23/40 ,  H01L21/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP3107358A1

公开(公告)日：2016-12-21

申请号：EP16174867.8

申请日：2016-06-16

Applicant: Ingenico Group

Inventor： ROSSIGNOL, Michel ,  BERTHIAUD, Olivier

IPC: H05K1/02

CPC classification number: H05K1/0275 ,  H01L2224/16225 ,  H05K1/0213 ,  H05K1/115 ,  H05K2201/10734

Abstract: L'invention se rapporte à un composant électronique (300). Un tel composant électronique comprend.
- une enveloppe (310) formant boitier;
- une plaque de circuit imprimé (320) ;
- une pluralité de billes intégrées au sein d'une matrice de bille (BGA) ;
il se distingue par le fait ladite plaque de circuit imprimé (320) comprend au moins un circuit définissant au moins un anneau de garde (Ag, A1, A2).

Abstract translation: 组件，用于敏感的信号，相应的设备和方法的保护，worin本发明涉及在电子部件那样，包括：一个包络成形的包装; 一个印刷电路板; 和集成到球栅阵列（BGA）滚珠的多元性; 所述印刷电路板包括至少一个电路，限定至少一个保护环。

公开(公告)号：EP2692478B1

公开(公告)日：2016-11-02

申请号：EP12764138.9

申请日：2012-03-28

Applicant: Senju Metal Industry Co., Ltd

Inventor： OHNISHI Tsukasa ,  YAMANAKA Yoshie ,  TACHIBANA Ken

IPC: B23K35/02 ,  B32B15/01 ,  H05K3/34 ,  H01L23/00 ,  B23K35/26 ,  C22C13/00

CPC classification number: B23K35/0244 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B32B15/018 ,  C22C13/00 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/01015 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/2076 ,  H05K3/3463 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/207 ,  H01L2924/00014

公开(公告)号：EP2688373A3

公开(公告)日：2016-06-22

申请号：EP13168141.3

申请日：2013-05-16

Applicant: FUJITSU LIMITED

Inventor： Kurashina, Mamoru ,  Mizutani, Daisuke ,  Fukumori, Taiga

IPC: H05K1/02 ,  H05K3/34 ,  H01L23/498 ,  H05K1/14 ,  H01L23/50

CPC classification number: H05K1/144 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/147 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4697 ,  H05K2201/0154 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126

Abstract: An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.

公开(公告)号：EP1506568B1

公开(公告)日：2016-06-01

申请号：EP03719987.4

申请日：2003-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： FJELSTAD, Joseph, C. ,  SEGARAM, Para, K. ,  HABA, Belgacem

IPC: H01L23/00 ,  H05K1/02 ,  H05K3/22 ,  H01L23/498 ,  H05K1/14

CPC classification number: H05K1/147 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0228 ,  H05K1/0237 ,  H05K3/222 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP1271649B1

公开(公告)日：2015-03-25

申请号：EP02254252.6

申请日：2002-06-18

Applicant: ATI Technologies Inc.

Inventor： Chan, Vincent ,  Ho, Samuel

IPC: H01L25/10 ,  H01L25/18 ,  H01L25/00 ,  H01L25/065 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H01L25/03

CPC classification number: H05K1/141 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/1005 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

公开(公告)号：EP2608258A1

公开(公告)日：2013-06-26

申请号：EP11306705.2

申请日：2011-12-20

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Riviere, Jean-Michel ,  Saxod, Karine

IPC: H01L23/433

CPC classification number: H05K7/20 ,  G01F1/20 ,  H01L23/34 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20436 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/1316 ,  H01L2924/00

Abstract: The invention concerns an electronic component package comprising a support and heat conductor 3 the heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.

Abstract translation: 本发明涉及一种包括支架和导热体3的电子部件包装，导热体具有突起，并且支架具有布置成能够接收突起的插座，使得在组装过程期间导热体相对于支架的移动是 降低。

公开(公告)号：EP1895586A3

公开(公告)日：2013-04-03

申请号：EP07122502.3

申请日：1998-09-28

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo ,  Mori, Yoji

IPC: H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H01L23/50 ,  H05K3/34 ,  H05K3/46

CPC classification number: H01L23/50 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/114 ,  H05K1/116 ,  H05K3/3457 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention relates to a package board having a core board (30) on each surface of which a plurality of conductor circuits are formed with an interlaminar resin insulating layer therebetween, wherein a plurality of soldering pads (75U,75D) are formed on the IC chip mounted side surface, as well as on the other side surface to be connected to another board, so that said soldering pads (75D) on the other side surface are larger than those on said IC chip side surface of said package board, and a dummy pattern (58M) is formed between conductor circuit patterns formed on said IC chip mounted side surface of said core board.

公开(公告)号：EP2389049B1

公开(公告)日：2013-03-06

申请号：EP11158346.4

申请日：2011-03-15

Applicant: FUJITSU LIMITED

Inventor： Kanai, Ryo ,  Kikuchi, Shunichi ,  Nakamura, Naoki ,  Sugino, Shigeru ,  Hatanaka, Kiyoyuki ,  Taketomi, Nobuo

IPC: H05K1/14 ,  H05K1/18 ,  H01L23/538 ,  H01L23/498

CPC classification number: H05K1/185 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4691 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00