公开(公告)号：EP4557360A1

公开(公告)日：2025-05-21

申请号：EP24210814.0

申请日：2024-11-05

Applicant: STMicroelectronics International N.V.

Inventor： STELLA, Cristiano Gianluca

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/495 ,  H01L23/433 ,  H01L25/07

Abstract: Packaged electronic device (50; 70), having a C-shaped leadframe (52) including a base section (52A) and a pair of transverse sections (52B) extending transversely to the base section. A first die (11A, 60) and a second die (11B, 60) have a first contact region (27) at a first main surface and a second contact region (29) at the second main surface; the first main surfaces of the first and the second dice are attached to a first face (58) of the base section (52A) of the leadframe (52). A first lead (53) is coupled to the second contact region (29) of the first die (11A, 60) and has a first external contact portion (53B). A second lead (53) is coupled to the second contact region (29) of the second die and has a second external contact portion (53B). A packaging mass (52) surrounds the leadframe (52), the first lead and the second lead (53), embeds the first and the second dice (11A, 11B, 60) and extends level with the base section (52A) and with the transverse sections (52B) of the leadframe (52) as well as with the external contact portions (53B) of the leads.