CIRCUIT AND METHOD FOR DRIVING A MICRO-ELECTRO-MECHANICAL RESONATOR OF A GYROSCOPE WITH A REDUCED EXCITATION OF SPURIOUS HARMONICS

    公开(公告)号:EP4400808A1

    公开(公告)日:2024-07-17

    申请号:EP24150665.8

    申请日:2024-01-08

    IPC分类号: G01C19/5726 G01C19/5776

    CPC分类号: G01C19/5726 G01C19/5776

    摘要: Driving circuit for a driving resonator stage (4) of a MEMS gyroscope (1) including at least a first and a second electrode (31,32) and a movable mass (20), the driving circuit (3A,3B) including: a synchronization stage (16) which receives an electrical position signal (sPOS1) indicative of the position of the movable mass (20) and generates a reference signal (sLOCK') phase- and frequency-locked with the electrical position signal (sPOSl); a driving stage (2) which generates, on the basis of the reference signal (sLOCK'), a first and a second driving signal (D1,D2), which are applied to the first and, respectively, the second electrodes (31,32), so that the movable mass (20) is subject to a first and a second electrostatic force which cause the movable mass (20) to oscillate. Each of the first and the second driving signals (Dl,D2) comprises, for each period of the reference signal (sLOCK'), a corresponding pulse, the pulses of the first and the second driving signals (Dl,D2) being temporally alternated and having a same duration (α*T0), the ratio (α) between the duration and the period (T0) of the reference signal (sLOCK') falling in the range [0.3-0.37] or in the range [0.63-0.7].

    MICROMECHANICAL DEVICE FOR ENHANCED ACCELERATION MEASUREMENT

    公开(公告)号:EP4235190A1

    公开(公告)日:2023-08-30

    申请号:EP23157012.8

    申请日:2023-02-16

    摘要: Micromechanical device (50) comprising: a semiconductor body (51); a movable structure (53) configured to oscillate relative to the semiconductor body (51) along an oscillation direction (61); and an elastic assembly (57) with an elastic constant (K eq ), coupled to the movable structure (53) and to the semiconductor body (51) and configured to deform along the oscillation direction (61) to allow the oscillation of the movable structure (53) as a function of an acceleration applied to the micromechanical device (50). The movable structure (53) and the semiconductor body (51) comprise a control structure (72) for the capacitive control of the oscillation of the movable structure (53): when the control structure (72) is electrically controlled in a first state the micromechanical device (50) is in a first operating mode wherein a total elastic constant (K t ) of the micromechanical device (50) has a first value, and when it is electrically controlled in a second state the micromechanical device (50) is in a second operating mode wherein the total elastic constant (K t ) has a second value lower than, or equal to, the first value.

    MEMS ACTUATOR FOR IN-PLANE MOVEMENT OF A MOBILE MASS AND OPTICAL MODULE COMPRISING THE MEMS ACTUATOR

    公开(公告)号:EP4105167A1

    公开(公告)日:2022-12-21

    申请号:EP22176138.0

    申请日:2022-05-30

    IPC分类号: B81B3/00 G01B11/02 G01S17/88

    摘要: The MEMS actuator (100) is formed by: a substrate (105); a mobile mass (120) that is suspended over the substrate in a first direction (Z) and extends mainly in a plane that defines a second direction (Y) and a third direction (X) perpendicular to the first direction; elastic elements (123A, 123B) arranged between the substrate and the mobile mass and having a first compliance, in a direction parallel to the first direction, lower than a second compliance, in a direction parallel to the second direction; and piezoelectric actuation structures (130A-130D, 135) having a portion fixed with respect to the substrate and a portion configured to deform in the first direction in the presence of an actuation voltage. The MEMS actuator is further formed by movement-transformation structures (126A-126D) coupled to the piezoelectric actuation structures and having an elastic movement-conversion structure (160) arranged between a piezoelectric actuation structure and the mobile mass. The elastic movement-conversion structure is compliant in a plane (YZ) formed by the first and the second directions and has a first principal axis of inertia (Ii) and a second principal axis of inertia (I 2 ) transverse to the first and the second directions.

    A MEMS ACCELEROMETRIC SENSOR HAVING HIGH ACCURACY AND LOW SENSITIVITY TO TEMPERATURE AND AGEING

    公开(公告)号:EP3524984A1

    公开(公告)日:2019-08-14

    申请号:EP19160151.7

    申请日:2016-10-19

    IPC分类号: G01P15/125 G01P15/08

    摘要: An out-of-plane MEMS accelerometric sensor, including: a supporting structure (3); a suspended region (92) of semiconductor material, mobile with respect to the supporting structure; at least one first modulation electrode (114), which is fixed to the supporting structure and is biased, in use, with an electrical modulation signal including at least one periodic component having a first frequency; and at least one first variable capacitor (130), formed by the suspended region and by the first modulation electrode, in such a way that the suspended region is subjected to a first electrostatic force that depends upon the electrical modulation signal. The accelerometric sensor further includes a sensing assembly (102, 104, 95a) which generates, when the accelerometric sensor is subjected to an acceleration, an electrical sensing signal, which indicates the position of the suspended region with respect to the supporting structure and includes a frequency-modulated component, which is a function of the acceleration and of the first frequency. The suspended region overlies the first modulation electrode and is anchored to the supporting structure by means of elastic suspension elements (98, 99), which enable rotation of the suspended region about an axis of rotation, which is parallel to a surface of main extension of the suspended region.

    MICROELECTROMECHANICAL RESONATOR WITH IMPROVED ELECTRICAL FEATURES

    公开(公告)号:EP3407492A1

    公开(公告)日:2018-11-28

    申请号:EP18172940.1

    申请日:2018-05-17

    IPC分类号: H03H9/24 H03H9/02

    摘要: A MEMS resonator (10) is equipped with a substrate (13); a moving structure (12) suspended above the substrate in a horizontal plane (xy) formed by a first (x) and a second (y) axis, having a first (12a) and a second (12b) arm, parallel to one another and extending along the second axis, coupled at their respective ends by a first (14a) and a second (14b) transverse joining element, forming an internal window (15); a first electrode structure (20), positioned outside the window, capacitively coupled to the moving structure; a second electrode structure (21), positioned inside the window, one of the first and second electrode structures causing an oscillatory movement of the flexing arms in opposite directions along the first horizontal axis at a resonance frequency, and the other of the first and second electrode structures having a function of detecting the oscillation; a suspension structure (16) having a suspension arm (17) in the window; and an attachment arrangement (18), coupled to the suspension element centrally in the window, near the second electrode structure.

    MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF USER INTERFACE ELEMENT

    公开(公告)号:EP4322410A1

    公开(公告)日:2024-02-14

    申请号:EP23188080.8

    申请日:2023-07-27

    IPC分类号: H03K17/975

    摘要: A microelectromechanical button device (5) is provided with a detection structure (14) having: a substrate (22) of semiconductor material with a front surface (22a) and a rear surface (22b); a buried electrode (28) arranged on the substrate; a mobile electrode (32), arranged in a structural layer (30) overlying the substrate and elastically suspended above the buried electrode at a separation distance so as to form a detection capacitor (Cd); and a cap (46) coupled over the structural layer and having a first main surface (46a) facing the structural layer and a second main surface (46b) that is designed to be mechanically coupled to a deformable portion (3) of a case (2) of an electronic apparatus (1) of a portable or wearable type. The cap has, on its first main surface, an actuation portion (48) arranged over the mobile electrode and configured to cause, in the presence of a pressure applied on the second main surface, a deflection of the mobile electrode and its approach to the buried electrode, with a consequent capacitive variation of the detection capacitor, which is indicative of an actuation of the microelectromechanical button device.

    METHOD FOR CORRECTING GYROSCOPE DEMODULATION PHASE DRIFT

    公开(公告)号:EP4148382A1

    公开(公告)日:2023-03-15

    申请号:EP22191021.9

    申请日:2022-08-18

    IPC分类号: G01C19/5649 G01C25/00

    摘要: A gyroscopic sensor unit (101) detects a phase drift between a demodulated output signal and a demodulation signal during output of a quadrature test signal. A delay calculator (116) detects the phase drift based on changes in the demodulated output signal during application of the quadrature test signal. A delay compensation circuit (118) compensates for the phase drift by delaying the demodulation signal by the phase drift value.

    MICROELECTROMECHANICAL SENSOR DEVICE WITH IMPROVED STABILITY TO STRESS

    公开(公告)号:EP3951403A1

    公开(公告)日:2022-02-09

    申请号:EP21190136.8

    申请日:2021-08-06

    IPC分类号: G01P15/125 G01P15/08

    摘要: A microelectromechanical sensor device (20) has a detection structure (21) provided with: a substrate (24) having a top surface (24a) extending in a horizontal plane (xy); a mobile structure (22, 26), having an inertial mass (22) suspended above the substrate at a first area (24') of the surface so as to perform at least one inertial movement with respect to the substrate as a function of a quantity to be detected; and a fixed structure (27a, 27b), having fixed electrodes suspended above the substrate at the first area (24') of the surface and defining with the mobile structure a capacitive coupling to form at least one sensing capacitor, whose capacitance value is indicative of the quantity to be detected. A single mechanical-anchorage structure (32) provides anchoring of both the mobile structure and the fixed structure to the substrate at a second area (24") of the surface, distinct and separate from the first area (24'); connection elements (34a-34c) couple the mobile structure and the fixed structure mechanically to the single mechanical-anchorage structure.

    MICROMECHANICAL DEVICE WITH ELASTIC ASSEMBLY HAVING VARIABLE ELASTIC CONSTANT

    公开(公告)号:EP3839520A1

    公开(公告)日:2021-06-23

    申请号:EP20212118.2

    申请日:2020-12-07

    摘要: A micromechanical device (50) comprising: a semiconductor body (51); a first mobile structure (53; 253); an elastic assembly (57, 59; 259), coupled to the first mobile structure and to the semiconductor body (51) and adapted to undergo deformation in a direction (X) ; and at least one abutment element (66b; 66a). The elastic assembly (57, 59; 259) is configured to enable an oscillation of the first mobile structure (53; 253) as a function of a force applied thereto. The first mobile structure (53; 253), the abutment element (66b; 66a) and the elastic assembly (57, 59; 259) are arranged with respect to one another in such a way that: when said force is lower than a force threshold, the elastic assembly (57, 59; 259) operates with a first elastic constant (K 1 ; K 4 ); and when said force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant (K 1 + K 2 ; K 5 ) different from the first elastic constant.
    Main figure: Figure 2

    WATERPROOF MEMS BUTTON DEVICE, INPUT DEVICE COMPRISING THE MEMS BUTTON DEVICE AND ELECTRONIC APPARATUS

    公开(公告)号:EP3799311A1

    公开(公告)日:2021-03-31

    申请号:EP20196998.7

    申请日:2020-09-18

    IPC分类号: H03K17/975

    摘要: A button device (6) includes a MEMS sensor (30), having a MEMS strain detection structure (42) and a deformable substrate (37) configured to undergo deformation under the action of an external force (F). In particular, the MEMS strain detection structure (42) includes a mobile element (62) carried by the deformable substrate (37) via at least a first and a second anchorage (67, 69), the latter fixed with respect to the deformable substrate (37) and are configured to displace and generate a deformation force (F t ) on the mobile element (62) in the presence of the external force (F); and stator elements (70, 72) capacitively coupled to the mobile element (62). The deformation of the mobile element (62) causes a capacitance variation (ΔC) between the mobile element (62) and the stator elements (70, 72). Furthermore, the MEMS sensor (30) is configured to generate detection signals (s C1 , S C2 ; S MEMS , s ref ) correlated to the capacitance variation (ΔC).