摘要:
A cyanate resin composition suitable for a copper-clad laminate comprises components (A) and (B).
(A) a cyanate compound of the formula: wherein R and Q each represents halogen, C₁₋₁₀ alkyl, C₅₋₇ cycloalkyl or C₆₋₂₀ hydrocarbon; i and j each represents 0-4 and M is (2): wherein T represents halogen, C₁₋₁₀ alkyl, C₅₋₇ cycloalkyl or C₆₋₂₀ hydrocarbon; k represents 0-10 and m represents 0-8, and (B) a hardener.
摘要:
A cyanate resin composition comprising as essential components a cyanate compound represented by formula (1) or its prepolymer and a curing agent:
wherein each of R₁ and R₂ represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; A represents an alkyl group having 1 to 3 carbon atoms; i represents an integer of 0 to 3 alone or together with a brominated epoxy compound or a maleimide compound or its prepolymer, said cyanate resin composition giving a cured product having a low-dielectric constant, and a copper-clad laminate composed of a prepreg of said cyanate resin composition and a copper foil.
摘要:
The present invention provides a halogen-containing cyanate ester obtained by cyanating a phenol represented by the following general formula (1): wherein A represents a hydrocarbon group having 1 to 6 carbon atoms; B represents a halogen atom; X represents a single bond, a hydrocarbon group having 1 to 20 carbon atoms, a carbonyl group, a sulfon group, a divalent sulfur atom or an oxygen atom; i represents an integer of 0 to 3; j represents an integer of 1 to 4; and n is 0 or 1 with a cyanogen halide in the presence of and a base, wherein a value obtained by dividing a maximum value of an absorbance at a wave number of 1600 to 1740 cm -1 by a maximum value of an absorbance at a wave number of 2100 to 2300 cm -1 is not more than 0.2, the absorbance of a 1.0 % (weight by volume) chloroform solution of the halogen-containing cyanate esters being measured at a cell length of 1.0 mm using an infrared spectrophotometer. The present invention also provide a process for producing the same, and a thermosetting resin containing the same.