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    Polyfunctional vinyl ether compounds and photoresist resin compositions containing them
    2.
    发明公开
    Polyfunctional vinyl ether compounds and photoresist resin compositions containing them 失效
    Polyfunktionelle Vinyletherverbindungen und diese enthaltende HarzzusammensetzungenfürPhotoresiste。

    公开(公告)号：EP0611784A1

    公开(公告)日：1994-08-24

    申请号：EP94301132.0

    申请日：1994-02-16

    申请人： SUMITOMO CHEMICAL COMPANY LIMITED

    发明人： Hozumi, Shigeo ,  Kitayama, Shinichiro ,  Nakagawa, Hiroya

    IPC分类号： C08G8/04 ,  C08G8/20 ,  C08G8/24 ,  C08G8/36 ,  G03F7/027

    CPC分类号： C08G8/20 ,  C08G8/04 ,  C08G8/22 ,  C08G8/24 ,  C08G8/28 ,  G03F7/027 ,  G03F7/0388

    摘要： The disclosed polyfunctional vinyl ether compounds are represented by formula (I):

    wherein n = 0 - 20; R₁ and R₂ = H, X, alkyl, aryl, aralkyl, alkoxy, aryloxy, or cycloalkyl; Q = -OH or -OROCH=CH₂, R being C₁₋₁₂. The molar ratio (-OH)/(-OROCH=CH₂) = 10/90 - 90/10; and A = a C₁₋₃₀ divalent hydrocarbon group. Alternative structures for the end groups and optional alternating intermediate groups are also disclosed.
    Compounds of the invention may be incorporated into both positive and negative working photoresist compositions.

    摘要翻译： 所公开的多官能乙烯基醚化合物由式（I）表示：其中n = 0-20的 R1和R2 = H，X，烷基，芳基，芳烷基，烷氧基，芳氧基或环烷基; Q = -OH或-OROCH = CH 2，R为C 1-12。 摩尔比（-OH）/（ - OROCH = CH2）= 10/90〜90/10; 和A = C1-30二价烃基。 还公开了端基和任选的交替中间体的替代结构。 本发明的化合物可以掺入正性和负性光致抗蚀剂组合物中。

    Method of producing light control plate which induces scattering of light at different angles
    3.
    发明公开
    Method of producing light control plate which induces scattering of light at different angles 失效
    一种制造板用于控制光在各个方向上的分散体的方法。

    公开(公告)号：EP0392868A2

    公开(公告)日：1990-10-17

    申请号：EP90304039.2

    申请日：1990-04-12

    申请人： NIPPON SHEET GLASS CO. LTD. ,  SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Tsujino, Toshifumi, c/o Nippon Sheet Glass Co. Ltd ,  Maeda, Kiochi, c/o Nippon Sheet Glass Co. Ltd. ,  Ishizuka, Satoshi, c/o Nippon Sheet Glass Co. Ltd. ,  Yamamoto, Hiroaki, c/o Nippon Sheet Glass Co. Ltd. ,  Kitayama, Shinichiro ,  Hozumi, Shigeo

    IPC分类号： G02B5/02 ,  G02B1/04 ,  G03B7/00 ,  G02B1/10

    CPC分类号： G02B5/0236 ,  G02B1/04 ,  G02B5/0257 ,  G02B5/0268 ,  G02B5/0278 ,  G03F7/0005

    摘要： A method of producing a light control plate for inducing scattering of light incident on a particular location of plate at a particular predetermined angle, at least some different locations on the plate requiring a different predetermined angle of incidence for scattering to occur. The method comprises (1) preparing an assembly comprising a film of a photopolymerizable composition and a light pervious body having a light-unpervious pattern arranged along the surface of the film, (2) irradiating the light-pervious body side of the assembly with light incident on the body at an angle within a predetermined range from a light source while moving the assembly continuously in the planar direction of the film thereby to polymerize at least part of the photopolymerizable film; and thereafter, (3) polymerizing the photopolymerizable composition of that portion of the film-like molded article which is covered with the light-impervious pattern of the light-pervious body by light irradiation or heating.

    摘要翻译： 产生用于在一个特定的预定角度上的特定板的位置诱导入射的光散射的光控制板的方法，至少在板的一些不同地点发生率要求的不同的预定角度散射发生。 该方法包括（1）在组装制备包含可光聚合的组合物的薄膜和具有沿所述膜的表面配置的光unpervious图案的光可透过的身体，（2）照射所述组件的与光的透光体侧 入射到身体在距光源的预定范围内的角度，同时连续移动所述组件在所述膜的平面方向，从而以聚合可光聚合的成膜的至少一部分; 之后，（3）聚合覆盖有通过光照射或加热的透光体的光不能透过的图案的薄膜状模塑制品的那样部分的所有的可光聚合组合物。

    Epoxy resin compositions and resin-encapsulated semiconductor devices
    4.
    发明公开
    Epoxy resin compositions and resin-encapsulated semiconductor devices 失效
    Epoxydharzzusammensetzungen undkunststoffumhüllteHalbleiteranordnungen。

    公开(公告)号：EP0598302A1

    公开(公告)日：1994-05-25

    申请号：EP93118081.4

    申请日：1993-11-08

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Sugiyama, Yasuhide ,  Shiomi, Yutaka ,  Morimoto, Takashi ,  Saito, Noriaki ,  Kitayama, Shinichiro ,  Suzuki, Michio ,  Sakiyama, Kazuo

    IPC分类号： C08G59/30 ,  C08G59/62 ,  H01L23/29 ,  C07D303/23

    CPC分类号： C07D303/22 ,  C08G59/302 ,  C08G59/621 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An epoxy resin composition which can provide cured products high in adhesion and crack resistance in soldering with high heat resistance and low moisture absorption and a semiconductor devices encapsulated with said composition are disclosed.
    The above epoxy resin composition comprises as essential components an epoxy resin represented by the following formula (1):

    wherein R₁ represents a halogen atom, an alkyl or cycloalkyl group of 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom and when two or more R₁ are present in the same or different rings, they may be the same or different and m represents an integer of 0 to 4, and a polyhydric phenol as a curing agent.

    摘要翻译： 公开了一种环氧树脂组合物，其可以提供具有高耐热性和低吸湿性的焊接中的粘合性和抗裂纹性的固化产物以及用所述组合物包封的半导体器件。 上述环氧树脂组合物包含作为必要成分的由下式（1）表示的环氧树脂：其中R1表示卤素原子，1〜6个碳原子的烷基或环烷基，取代或未取代的苯基或 卤素原子，当两个以上的R 1存在于相同或不同的环时，它们可以相同或不同，m表示0〜4的整数，作为固化剂的多元酚。

    Unsaturated imide compounds containing alicyclic structure
    6.
    发明公开
    Unsaturated imide compounds containing alicyclic structure 失效
    UngesältigteImide-Verbindungen die eine alicyclische Struktur enthalten。

    公开(公告)号：EP0595230A1

    公开(公告)日：1994-05-04

    申请号：EP93117252.2

    申请日：1993-10-25

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Hirano, Yasuhiro ,  Endo, Yasuhiro ,  Takebe, Kazuo ,  Shibata, Mitsuhiro ,  Kanagawa, Shuichi ,  Shiomi, Yutaka ,  Akiba, Masatsugu ,  Kitayama, Shinichiro

    IPC分类号： C07D207/44 ,  C08G73/10 ,  C07C205/38 ,  C07C217/90

    CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

    摘要： An unsaturated imide compound represented by formula (1):

    wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R₁, R₂, R₃, R₄, R i and R j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a + b ≦ 4 , c + d ≦ 4 and e + f ≦ 4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

    摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含有4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机物 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，低吸水性和柔软性优异的固化产物。

    Halogen containing epoxy resin composition and copper-clad laminate
    10.
    发明公开
    Halogen containing epoxy resin composition and copper-clad laminate 失效
    含卤素的环氧树脂组合物和覆铜层压板

    公开(公告)号：EP0590463A3

    公开(公告)日：1994-10-19

    申请号：EP93115110.4

    申请日：1993-09-20

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Ueda, Yoichi ,  Endo, Yasuhiro ,  Shibata, Mitsuhiro ,  Kamio, Kunimasa ,  Kitayama, Shinichiro ,  Yamasaki, Kaori ,  Hayashi, Toshiaki

    IPC分类号： C08G59/06 ,  C08L63/00 ,  B32B15/20 ,  B32B27/38 ,  B32B15/08

    CPC分类号： B32B15/14 ,  B32B15/08 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  C08G59/06 ,  C08G59/08 ,  C08G59/38 ,  C08L63/00 ,  H05K1/034 ,  C08L2666/08 ,  C08L2666/22

    摘要： An epoxy resin composition excellent in heat resistance and low in dielectric and a copper-clad laminate obtained by molding it are disclosed. The epoxy resin composition of the invention comprises:
    (1) a compound obtainable by previously reacting (A) an epoxy resin obtainable by glycidyl etherifying a 3-methyl-6-(C 4 -C 8 )alkylphenol novolak with (B) a halogen-containing bisphenol compound represented by the following formula (1):

    wherein R 1 represents a hydrogen atom or a methyl group and the two R 1 may be identical or different, X and X' represent halogen atom and may be identical or different, and i and j independently of one another are integers of 1 to 4, or a compound obtainable by previously reacting (A) the above epoxy resin, (B) the above halogen-containing bisphenol compound and (C) a glycidyl etherification product of a halogen-containing bisphenol compound which is represented by the following formula (2):

    wherein R 2 represents a hydrogen atom or a methyl group and the two R 2 may be identical or different, Y and Y' represent halogen atom and may be identical or different, n represents an average recurring unit number and is 0 to 10 and k and I independently of one another are integers of 1 to 4, and (2) an epoxy hardener.

    摘要翻译： 公开了一种耐热性和电介质低的环氧树脂组合物以及通过模塑而获得的覆铜层压板。 本发明的环氧树脂组合物包含：（1）预先使（A）环氧树脂与（B）含有卤素的环氧树脂反应而得到的化合物，所述环氧树脂可通过将3-甲基-6- 由下式（1）表示的双酚化合物：其中R1表示氢原子或甲基，并且两个R1可以相同或不同，X和X'表示卤素原子并且可以相同或不同，并且i和j独立地为 （A）上述环氧树脂，（B）上述含卤素双酚化合物和（C）含卤素双酚化合物的缩水甘油醚化产物而得到的化合物 其由下式（2）表示：其中R 2表示氢原子或甲基，并且两个R 2可以相同或不同，Y和Y'表示卤素原子并且可以相同或不同，n表示平均重复单元 单位数量 r且为0至10且k和I彼此独立地为1至4的整数，和（2）环氧硬化剂。