-
1.CUTTING TOOL, PRODUCTION METHOD FOR SAME, AND PRODUCTION DEVICE 审中-公开
标题翻译: SCHNEIDEWERKZEUG,VERFAHREN ZU SEINER HERSTELLUNG UND VORRICHTUNG ZU SEINER HERSTELLUNG公开(公告)号:EP2636478A4
公开(公告)日:2017-08-16
申请号:EP11837815
申请日:2011-09-16
发明人: NAKAMAE KAZUO , MURASE HIROYUKI , YAMAMOTO KATSUKO , ONO MAMORU , TANAKA KATSUYUKI , SAKATA TOSHIMITSU , ENAMI TERUHIRO , KOBAYASHI YUTAKA
IPC分类号: B23P15/28 , B23D65/02 , B23K26/00 , B23K26/04 , B23K26/06 , B23K26/08 , B23K26/38 , B23K26/40 , B23K103/00
CPC分类号: B23K26/0648 , B23C2226/125 , B23C2226/315 , B23C2260/56 , B23D65/02 , B23K26/06 , B23K26/0613 , B23K26/064 , B23K26/0823 , B23K26/38 , B23K26/40 , B23K2203/50 , Y10T407/27
-
2.TOOL CHIP, BONDING TOOL WITH THE TOOL CHIP, AND METHOD FOR CONTROLLING THE BONDING TOOL 失效
标题翻译: 工具SPAN,带有用于检查连接夹具该芯片和方法链接工具公开(公告)号:EP0910122A4
公开(公告)日:2007-07-04
申请号:EP97922188
申请日:1997-05-26
发明人: YAMAMOTO KATSUKO , IGUCHI TAKAHISA , KUMAZAWA YOSHIAKI , TANAKA KATSUYUKI , SHIOMI HIROMU , TSUNO TAKASHI , FUJIMORI NAOJI
CPC分类号: H01L21/67138 , B23K26/382 , B23K26/40 , B23K2201/20 , B23K2201/35 , B23K2203/50 , B23K2203/52 , Y10T428/24355 , Y10T428/24628 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/26 , Y10T428/30
摘要: A conductive polycrystalline diamond film having a specific resistance of 1x10-4 to 1x103Φcm and a thickness 1-500 νm is formed on the surface of a substrate used for contact bonding, the opposite surface of the substrate, or two or more side faces of the substrate intersecting the surfaces by using a vapor phase synthesis method.
摘要翻译: 的至少1×10 <-4> OMEGA m和小于1×10 <3> OMEGA米,谁的膜厚度为至少0.1微米的范围内,不超过500 A-具有薄膜导电的多晶金刚石的电阻率 微米,是电影形成的由气相合成为压接,一个表面相对该表面或至少两个侧表面与上基片表面的论文采用相交的表面上。
-