公开(公告)号：EP4335899A1

公开(公告)日：2024-03-13

申请号：EP22798839.1

申请日：2022-03-22

申请人： Sakata INX Corporation

发明人： SHIRAKAWA, Yuki

IPC分类号： C08K5/09 ,  C08L101/00 ,  H01B1/00 ,  H01B1/22 ,  C08K3/08 ,  C08K3/11

摘要： An object is to provide a conductive resin composition that offers low volume resistivity and demonstrates good conductivity when formed into a conductive film, can be used in place of silver paste, and proves useful as a conductive ink, circuit connection material, etc. As a solution, a conductive resin composition is provided that contains a tin powder, resin, and organic acid compound.

公开(公告)号：EP4424769A1

公开(公告)日：2024-09-04

申请号：EP22887006.9

申请日：2022-10-25

申请人： Sakata INX Corporation

发明人： SHIRAKAWA, Yuki ,  FUKUSHIMA, Ko

IPC分类号： C08L63/00 ,  C08K3/08 ,  C08K5/09 ,  C08K5/13 ,  C08K5/1539 ,  C08K5/37 ,  C08L61/06 ,  H01B1/22

CPC分类号： C08K3/08 ,  C08K5/13 ,  C08K5/09 ,  C08K5/1539 ,  C08K5/37 ,  C08L61/06 ,  C08L63/00 ,  H01B1/22

摘要： An object is to provide a conductive resin composition that demonstrates good conductivity and excellent adhesion (joining strength) with respect to various types of base materials and is useful as conductive inks, conductive adhesives, circuit connection materials, etc., and also to provide a conductive film formed by the conductive resin composition, a conductive ink containing the conductive resin composition, a conductive adhesive containing the conductive resin composition, and a circuit connection material containing the conductive resin composition. As a solution, a conductive resin composition is provided that contains (a) tin powder, (b) epoxy resin, and (c) organic acid compound, and satisfies requirement (A) and/or requirement (B) below:
(A): the content of the (a) tin powder, relative to the total amount, 100% by mass, of the (a) tin powder, (b) epoxy resin, and (c) organic acid compound, is 90.1% by mass or higher; and/or
(B): (d) curing agent is contained, and (d) curing agent includes one or more types selected from (d1) acid anhydride-based curing agents, (d2) thiol-based curing agents and (d3) phenol-based curing agents.

公开(公告)号：EP4286477A1

公开(公告)日：2023-12-06

申请号：EP21923051.3

申请日：2021-10-28

申请人： Sakata INX Corporation

发明人： SASAKI, Masayuki ,  SHIRAKAWA, Yuki ,  FUKUSHIMA, Ko ,  FUJII, Kaori

IPC分类号： C08L29/14 ,  C08L61/06 ,  C09D11/52 ,  H01B1/22 ,  C08K3/08 ,  H05K1/09

摘要： An object of the present invention is to provide a conductive resin composition that achieves low volume resistivity and thus exhibits good conductivity when formed into a conductive film, offers good adhesion to various types of base materials, and demonstrates excellent storage stability, and therefore proves useful as a conductive ink, circuit connection material, etc. As a solution, a conductive resin composition is provided that contains: (a) one or more types of conductive powders selected from the group consisting of silver-based metal powders, copper-based metal powders, aluminum-based metal powders, iron-based metal powders, nickel-based metal powders, zinc-based metal powders, tin-based metal powders, and gold-based metal powders; and (b) a polyvinyl butyral-based resin; and also contains (c) a resol-type phenol-based resin by 0 to 75 parts by mass relative to 100 parts by mass of polyvinyl butyral-based resin.