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公开(公告)号：EP4303924A1
公开(公告)日：2024-01-10
申请号：EP22784761.3
申请日：2022-02-14
发明人： LEE, Sangho , KIM, Kihyun , PARK, Sangyong , BAEK, Kwanghyun , BAEK, Seungjae
IPC分类号： H01L23/64 , H01L23/492 , H01L23/485 , H01L23/528 , H01L23/00
摘要： A package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a die connected to the plurality of upper solder balls, a plurality of lower lands disposed on the other surface of the substrate, a plurality of lower solder balls disposed on some of the plurality of lower lands, and a capacitor connected to the lower lands on which the lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and including a height greater than the height of the lower solder ball.
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公开(公告)号：EP4379951A1
公开(公告)日：2024-06-05
申请号：EP22867560.9
申请日：2022-07-29
发明人： LEE, Sangho , PARK, Sangyong , PARK, Hyunchul , BAEK, Kwanghyun , BAEK, Seungjae , YOON, Seunghwan
CPC分类号： H04M1/02 , H01Q1/246 , H01Q3/26 , H01Q9/0414 , H01Q1/405 , H04B1/3833 , H04B1/44
摘要： An electronic device, according to one embodiment, may comprise: a switch die comprising a first part transmission path and a first part reception path, the first part transmission path having a transmission switch connected in parallel thereto, and the first part reception path having a reception switch connected in parallel thereto; a first bonding unit comprising a conductive material connected to the first part transmission path; a second bonding unit comprising a conductive material connected to a second part transmission path; and a radio unit (RU) board comprising the second part transmission path connected to the first bonding unit, and a second part reception path connected to the second bonding unit. Other various embodiments are possible.
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