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    LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE HAVING THE SAME
    1.
    发明公开
    LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE HAVING THE SAME 审中-公开

    公开(公告)号：EP3809461A1

    公开(公告)日：2021-04-21

    申请号：EP20200888.4

    申请日：2020-10-08

    申请人： Samsung Electronics Co., Ltd.

    发明人： JUNG, Youngki ,  SHIN, Sangmin ,  KIM, Jinho ,  JUNG, Chulgyu

    IPC分类号： H01L25/075 ,  H01L33/62

    摘要： Provided are a light emitting diode (LED) module that enables a freedom in structure design thereof using a fan-out interconnection and an insulating layer, and a display device having the same. The LED module having a multi-layer structure includes substrate; a LED located on the substrate and emitting light toward the substrate; a plurality of upper electrodes located on the LED and connected to the LED; an upper insulating layer provided to surround the plurality of upper electrodes; a film on glass (FOG) electrode located on the upper insulating layer; and a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.

    DISPLAY MODULE HAVING LED PACKAGES AND MANUFACTURING METHOD THEREOF
    4.
    发明公开
    DISPLAY MODULE HAVING LED PACKAGES AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：EP3770963A1

    公开(公告)日：2021-01-27

    申请号：EP20176932.0

    申请日：2020-05-27

    申请人： Samsung Electronics Co., Ltd.

    发明人： KANG, Jinhee ,  PARK, Taesoon ,  JUNG, Youngki ,  JUNG, Chulgyu

    IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/52

    摘要： A display module and a manufacturing method thereof is provided. The display module may include a substrate; a thin film transistor (TFT) layer disposed on a surface of the substrate; a plurality of LED packages including a connection substrate and a plurality of LEDs disposed on a first surface of the connection substrate; and a wiring configured to electrically connect the TFT layer and the plurality of LEDs. The wiring includes a first wiring for electrically coupling with the plurality of LEDs on the first surface, and a second wiring for electrically coupling with the TFT layer on a second surface of the connection substrate.

    LIGHT-EMITTING DIODE AND DISPLAY MODULE USING SAME
    5.
    发明公开
    LIGHT-EMITTING DIODE AND DISPLAY MODULE USING SAME 审中-公开

    公开(公告)号：EP4258367A1

    公开(公告)日：2023-10-11

    申请号：EP21940942.2

    申请日：2021-11-08

    申请人： Samsung Electronics Co., Ltd.

    发明人： KIM, Myunghee ,  PARK, Seungran ,  JUNG, Youngki ,  JUNG, Chulgyu

    IPC分类号： H01L33/38 ,  H01L27/15 ,  H01L25/075 ,  H01L27/12

    摘要： A light-emitting diode and a display module using the same is disclosed. The light-emitting diodes includes a first semiconductor layer, an active layer provided on the first semiconductor layer, a second semiconductor layer provided on the active layer, a first chip electrode covering a first portion of an upper surface of the second semiconductor layer and a portion of a first side surface of the second semiconductor layer, and a second chip electrode covering a second portion of the upper surface of the second semiconductor layer different from the first portion of the upper surface of the second semiconductor layer and covering a second side surface of the second semiconductor layer different from the first side surface of the second semiconductor layer.

    DISPLAY MODULE
    6.
    发明公开
    DISPLAY MODULE 审中-公开

    公开(公告)号：EP4177972A1

    公开(公告)日：2023-05-10

    申请号：EP21883109.7

    申请日：2021-10-13

    申请人： Samsung Electronics Co., Ltd.

    发明人： KIM, Myunghee ,  JUNG, Youngki ,  KIM, Donghwan ,  NAMKUNG, Yong ,  JUNG, Chulgyu

    IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L27/12 ,  H01L21/52

    摘要： A display module is disclosed. The display module includes a substrate; a plurality of inorganic light-emitting diodes provided in a plurality of mounting grooves formed in the substrate, the plurality of inorganic light-emitting diodes including an inorganic light-emitting diode that has a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad provided around the mounting groove.