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15 条记录 (耗时 0.014 秒)

    ELECTRONIC DEVICE COMPRISING HEAT DISSIPATING MEMBER
    1.
    发明公开
    ELECTRONIC DEVICE COMPRISING HEAT DISSIPATING MEMBER 审中-公开

    公开(公告)号：EP4231119A1

    公开(公告)日：2023-08-23

    申请号：EP21906943.2

    申请日：2021-12-02

    申请人： Samsung Electronics Co., Ltd.

    发明人： JUNG, Chunghyo ,  PARK, Hyein ,  LIM, Jaedeok ,  KOO, Kyungha ,  MOON, Hongki

    IPC分类号： G06F1/20 ,  G06F1/16 ,  H05K7/20 ,  H05K1/11 ,  H05K5/00

    摘要： Disclosed is an electronic device comprising: a first heat dissipating part plated on the front surface of a rear case and comprising a first part extending in the direction toward a side surface member; a second heat dissipating part plated on the rear surface of the rear case and comprising a second part extending in the direction toward the side surface member; a via hole passing through the first heat dissipating part and second heat dissipating part; and an edge heat dissipating part plated on one area of an edge connecting the front surface and rear surface of the rear case, and connecting the first heat dissipating part and second heat dissipating part into one body. Various other embodiments understood through the specification are also possible.

    ELECTRONIC DEVICE COMPRISING MAGNET ARRAY
    2.
    发明公开
    ELECTRONIC DEVICE COMPRISING MAGNET ARRAY 审中-公开

    公开(公告)号：EP4167049A1

    公开(公告)日：2023-04-19

    申请号：EP21842221.0

    申请日：2021-07-05

    申请人： Samsung Electronics Co., Ltd.

    发明人： PARK, Sangil ,  PARK, Myeongsil ,  PARK, Juwan ,  PARK, Hyein ,  YOU, Jaehyoung ,  YOON, Shinhyuk ,  LIM, Jaedeok ,  CHO, Gyuyeong ,  CHOI, Seungbum ,  HONG, Hyunju

    IPC分类号： G06F1/16 ,  G09F9/30 ,  H01F27/34 ,  H01F7/02

    摘要： An electronic device according to various embodiments of the present invention comprises: a foldable housing which has a hinge structure and includes a first housing and a second housing, wherein the first housing is connected to the hinge structure and includes a first surface facing a first direction, a second surface facing a second direction opposite the first direction, and a first side surrounding at least a portion of the space between the first surface and the second surface, and the second housing is connected to the hinge structure and includes a third surface facing a third direction, a fourth surface facing a fourth direction opposite the third direction, and a second side surrounding at least a portion of the space between the third surface and the fourth surface, the first surface facing the third surface when the electronic device is in a folded state, and the third direction being the same as the first direction when the electronic device is in an unfolded state; a flexible display extending from the first surface to the third surface; and a magnet array which has a plurality of magnets in a three-dimensional multipolar magnetic arrangement, and includes a first magnet array disposed within the first housing and a second magnet array disposed within the second housing, wherein the first magnet array may correspond to the second magnet array when the electronic device is in the folded state.

    ELECTRONIC DEVICE COMPRISING ARRAY MAGNET AND METHOD FOR MANUFACTURING ARRAY MAGNET
    3.
    发明公开
    ELECTRONIC DEVICE COMPRISING ARRAY MAGNET AND METHOD FOR MANUFACTURING ARRAY MAGNET 审中-公开

    公开(公告)号：EP4270424A1

    公开(公告)日：2023-11-01

    申请号：EP22742825.7

    申请日：2022-01-19

    申请人： Samsung Electronics Co., Ltd.

    发明人： CHO, Gyuyeong ,  LIM, Jaedeok ,  PARK, Sangil

    IPC分类号： H01F7/02 ,  H01F41/02

    摘要： A method for manufacturing a magnetic member according to various embodiments disclosed in the present document may comprise the steps of: processing a case including a groove; inserting a first magnet, a second magnet, and a third magnet into the groove, so that the first magnet is disposed to have a magnetic force oriented in a first direction, the second magnet is disposed to have a magnetic force oriented in a second direction different from the first direction, and the third magnet, which is in a non-magnetized state, is disposed between the first magnet and the second magnet; coupling the case and a cover, so that the inserted magnets are surrounded and fixed by the case and the cover; and magnetizing the third magnet, so that the third magnet forms magnetic force in a third direction different from the first direction and the second direction. Various other embodiments identified through the specification are possible.

    SHIELDING MEMBER AND ELECTRONIC DEVICE COMPRISING SHIELDING MEMBER
    5.
    发明公开
    SHIELDING MEMBER AND ELECTRONIC DEVICE COMPRISING SHIELDING MEMBER 审中-公开

    公开(公告)号：EP4297546A1

    公开(公告)日：2023-12-27

    申请号：EP22833678.0

    申请日：2022-06-30

    申请人： Samsung Electronics Co., Ltd.

    发明人： CHO, Gyuyeong ,  LIM, Jaedeok ,  SUNG, Jongsoo ,  LIM, Gunbae ,  CHOI, Dusun

    IPC分类号： H05K9/00 ,  G06F3/0354

    摘要： An electronic device according to various embodiments disclosed in this document may include: a display panel; a recognition member disposed under the display panel and including a conductive pattern to recognize a signal from a pen input device; a first shielding member disposed under the recognition member; and a second shielding member disposed under the first shielding member and made of a material different from that of the first shielding member, wherein the second shielding member includes a component region facing at least one electronic component disposed under the second shielding member, and wherein at least a portion of the second shielding member is removed from the component region.

    SHIELDING STRUCTURE FOR REDUCING CROSSTALK OF OPTICAL SENSOR AND METHOD FOR MANUFACTURING SAME
    6.
    发明公开
    SHIELDING STRUCTURE FOR REDUCING CROSSTALK OF OPTICAL SENSOR AND METHOD FOR MANUFACTURING SAME 审中-公开

    公开(公告)号：EP4280285A1

    公开(公告)日：2023-11-22

    申请号：EP23710655.4

    申请日：2023-03-16

    申请人： Samsung Electronics Co., Ltd.

    发明人： CHOI, Gwangho ,  PARK, Hyein ,  LIM, Jaedeok

    IPC分类号： H01L27/146 ,  H04N25/62

    摘要： An electronic device according to an embodiment of the disclosure includes an upper structure that forms at least a portion of an exterior of the electronic device, a sensor module including a light emitting unit and a light receiving unit spaced apart from each other on a surface thereof that faces in a first direction and faces the upper structure, and a shielding structure that has a thin film form and surrounds at least a portion of the surface of the sensor module that faces in the first direction, the first direction being a direction in which the light emitting unit emits light. The upper structure is spaced apart from a surface of the shielding structure that faces in the first direction. The shielding structure includes a shielding film layer, a lusterless layer, and a diffuse reflection layer stacked on the sensor module in the first direction. The diffuse reflection layer is formed of a mixture of a plurality of silica particles and a binder and includes, on a surface of the diffuse reflection layer, a plurality of raised parts having a mountain shape, the width of which is decreased in the first direction.