CMOS image sensor and method of manufacturing the same
    3.
    发明公开
    CMOS image sensor and method of manufacturing the same 审中-公开
    CMOS-Bildsensor und Verfahren zu dessen Herstellung

    公开(公告)号:EP2249384A2

    公开(公告)日:2010-11-10

    申请号:EP10152306.6

    申请日:2010-02-01

    IPC分类号: H01L27/146

    摘要: Provided is a complementary metal oxide semiconductor (CMOS) image sensor having a structure capable of increasing areas of photodiodes in unit pixels and expanding light receiving areas of the photodiodes. In the CMOS image sensor, transfer transistors may be formed on the photodiode, and reset transistors, source follower transistors, and selection transistors may be formed on a layer on which the transfer transistors are not formed. In such a CMOS image sensor, the areas of the photodiodes may be increased in unit pixels so that a size of the unit pixels may be reduced and sensitivity of the pixel may be improved.

    摘要翻译: 提供了具有能够增加单位像素中的光电二极管的面积并且扩大光电二极管的光接收面积的结构的互补金属氧化物半导体(CMOS)图像传感器。 在CMOS图像传感器中,可以在光电二极管上形成传输晶体管,并且可以在不形成传输晶体管的层上形成复位晶体管,源极跟随器晶体管和选择晶体管。 在这种CMOS图像传感器中,可以以单位像素增加光电二极管的面积,从而可以降低单位像素的尺寸,并且可以提高像素的灵敏度。