摘要:
The present invention relates to a housing for radiation-emitting or radiation-receiving optoelectronic components, such as LEDs, and to a method for producing said housing. The housing comprises a composite assembly comprising a base part (1) and a head part (5) which are connected by means of a glass layer (2). One section of the top side of the base part defines a mounting region (12) for an optoelectronic functional element (60) and is additionally a heat sink for the optoelectronic functional element. The head part extends, at least in sections, over the periphery of the mounting region and forms, above the mounting region, a passage region (52, 61) for the radiation emitted by the optoelectronic functional element or the radiation to be received. When assembling the base part, the glass layer and the head part, the glass layer is heated to such an extent that the glass reaches a viscosity at which the glass adheres, and the base part and the head part form a composite assembly by means of the first glass layer. Glass makes it possible to produce a hermetic encapsulation with increased thermal stability.
摘要:
The invention relates to a housing for optoelectronic components, such as LEDs, and to a method for producing said housing. The housing is a housing for receiving a functional element, in particular an LED, consisting of a main part. The main part comprises an upper face, which defines a mounting region for at least one optoelectronic functional element at least in some sections such that the main part forms a heat sink for at least one optoelectronic functional element, and the main part also comprises a lower face and a casing. The housing also consists of at least one connecting part for at least one optoelectronic functional element, said connecting part being connected to the main part at least by means of a glass layer. The at least one connecting part lies on the casing side of the main part and extends along the periphery of the main part at least along some sections, and at least the upper face of the main part has at least one first depression with a base that provides the mounting region for at least one optoelectronic functional element.
摘要:
The invention relates to a housing for electronic components, such as LEDs and/or FETs. In general, the invention proposes the use of an alkali titanium silicate glass in order to construct the housing. Among others, this allows the construction of an extremely hermetic housing. The housing is a housing for receiving an electronic functional element, in particular an LED and/or an FET, consisting of a main part. The main part comprises an upper face, which defines a mounting region for at least one electronic functional element at least in some sections such that the main part forms a heat sink for at least one electronic functional element, and the main part also comprises a lower face and a casing. The housing also consists of at least one connecting part for at least one electronic functional element, said connecting part being connected to the main part at least by means of a glass layer, wherein the connecting glass layer is provided by an alkali titanium silicate glass.
摘要:
The invention relates to an optical converter system for LEDs, preferably for so-called (W)LEDs, and to a method for producing said optical converter system. The modular optical converter system comprises an inorganic converter (1) for converting the radiation emitted by the LED, an inorganic optical component (2), preferably comprising glass, which is mounted downstream of the converter in the direction of emission of the LED, the converter and the first optical component resting against each other and being connected in at least sections thereof. The optical converter system has a temperature resistance which lies above that of systems known from the prior art. The preferred components of the system are substantially UV-resistant and chemically resistant.
摘要:
Die vorliegende Erfindung betrifft ein Gehäuse für elektronische Bauteile, wie LEDs und/oder FETs. Allgemein sieht die Erfindung vor, ein Alkali-Titan-Silikat-Glas zum Aufbau des Gehäuses zu verwenden. Dieses ermöglicht unter anderem den Aufbau eines äußerst hermetischen Gehäuses. Das Gehäuse ist ein Gehäuse zur Aufnahme eines elektronischen Funktionselements, insbesondere einer LED und/oder eines FETs, aus einem Basiskörper mit einer Oberseite, welche zumindest abschnittsweise einen Montagebereich für wenigstens ein elektronisches Funktionselement definiert, so dass der Basiskörper einen Kühlkörper für wenigstens ein elektronisches Funktionselement bildet, einer Unterseite und einem Mantel; und wenigstens einem Anschlusskörper für wenigstens ein elektronisches Funktionselement, welcher zumindest mittels einer Glasschicht mit dem Basiskörper verbunden ist, wobei die verbindende Glasschicht durch ein Alkali-Titan-Silikat-Glas bereitgestellt ist.