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公开(公告)号：EP1080925B1
公开(公告)日：2003-07-30
申请号：EP00908043.3
申请日：2000-03-13
IPC分类号： B41J2/335
CPC分类号： B41J2/3353 , B41J2/3355 , B41J2/3357 , B41J2/3359 , Y10T29/49083 , Y10T29/49101 , Y10T29/49789 , Y10T29/4979
摘要： The size of the base of a thermal head is reduced forming a passivation film selectively, and hence the number of bases from one green sheet is increased, improving the productivity. Further improved are the positioning precision, the adhesion and the reliability of the passivation film. The portion requiring no passivation film of a wiring electrode is masked with inorganic paste, and the passivation film is formed all over the surface. The passivation film on the portion requiring no passivation film is removed together with the inorganic paste, and the passivation film is selectively formed on a heating body and a heating portion of the wiring electrode around the heating body.
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2.发明公开THERMAL HEAD, THERMAL HEAD UNIT, AND METHOD OF MANUFACTURE THEREOF 有权THERMOKOPF，THERMOKOPFEINHEIT UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP1108552A1
公开(公告)日：2001-06-20
申请号：EP99937006.7
申请日：1999-08-09
发明人： TAKIZAWA, Osamu, Seiko Instruments Inc. , SAMBONGI, Norimitsu, Seiko Instruments Inc. , SHOJI, Noriyoshi, Seiko Instruments Inc. , NAKAMURA, Yuji, Seiko Instruments Inc. , ITO, Taro, Seiko Instruments Inc. , YAMAGUCHI, Yumiko, Seiko Instruments Inc.
IPC分类号： B41J2/335
CPC分类号： B41J2/3351 , B41J2/33575 , B41J2/3359 , B41J2/345
摘要： The productivity of a board forming process is improved, the handling ability during a mounting process is enhanced, and the cost is remarkably reduced. In a thermal head (10) having a head chip 20 having one surface on which heating elements (24) and electrodes (25) connected to the heating elements (24) are provided, and a semiconductor integrated circuit (32) connected to the electrodes (24), a wiring substrate (30) is provided, which is joined to the other surface of the head chip (20), and the semiconductor integrated circuit 32 is mounted to the wiring substrate (30).
摘要翻译： 提高了板形成工艺的生产率，提高了安装过程中的处理能力，显着降低了成本。 在具有头部芯片20的热敏头（10）中，具有一个表面，在该表面上设有连接到加热元件（24）的加热元件（24）和电极（25），以及与电极连接的半导体集成电路 （24）中，设置与头芯片（20）的另一面接合的配线基板（30），并且将半导体集成电路32安装在布线基板（30）上。
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公开(公告)号：EP1080925A1
公开(公告)日：2001-03-07
申请号：EP00908043.3
申请日：2000-03-13
IPC分类号： B41J2/335
CPC分类号： B41J2/3353 , B41J2/3355 , B41J2/3357 , B41J2/3359 , Y10T29/49083 , Y10T29/49101 , Y10T29/49789 , Y10T29/4979
摘要： By selectively forming a protective film, the substrate size is made smaller, the number of the thermal heads taken from one substrate increases, and the productivity is improved. Further, the positioning accuracy of the protective film, the adhesion of the protective film, and the reliability are improved.
In order to attain this, a portion where the protective film is unnecessary of a wiring electrode is masked using inorganic paste, the protective film is formed over the whole surface, and then, the protective film at the portion where the protective film is unnecessary is peeled off together with the inorganic paste to selectively form the protective film on a heater and a heat generating portion of the wiring electrode on the periphery thereof.摘要翻译： 通过选择性地形成保护膜，使基板尺寸变小，从一个基板取出的热敏头的数量增加，生产率提高。 此外，保护膜的定位精度，保护膜的粘附性和可靠性得到改善。 为了达到这个目的，使用无机浆料对不需要保护膜的部分进行掩模，在整个表面上形成保护膜，然后在不需要保护膜的部分保护膜是 与无机糊一起剥离，以在周边的布线电极的加热器和发热部上选择性地形成保护膜。
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公开(公告)号：EP1108552B1
公开(公告)日：2006-04-19
申请号：EP99937006.7
申请日：1999-08-09
发明人： TAKIZAWA, Osamu, Seiko Instruments Inc. , SAMBONGI, Norimitsu, Seiko Instruments Inc. , SHOJI, Noriyoshi, Seiko Instruments Inc. , NAKAMURA, Yuji, Seiko Instruments Inc. , ITO, Taro, Seiko Instruments Inc. , YAMAGUCHI, Yumiko, Seiko Instruments Inc.
IPC分类号： B41J2/345
CPC分类号： B41J2/3351 , B41J2/33575 , B41J2/3359 , B41J2/345
摘要： The productivity of a substrate process and the handleability in a mounting process are improved for a substantial cost reduction. A thermal head (10) comprises a head chip (20), on one side of which are formed heating elements (24) and electrodes (25) connected with the heating elements (24); and an integrated circuit (32) connected with the electrodes (24). The other side of the head chip (20) is connected with a circuit board (30) on which the integrated circuit (32) is mounted.
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