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公开(公告)号：EP4317322A1
公开(公告)日：2024-02-07
申请号：EP22780635.3
申请日：2022-03-25
发明人： IWAMOTO, Tatsuya , KITADA, Gaku , KANEKO, Toshiki , SATO, Daichi
IPC分类号： C08L83/07 , C08L83/05 , C09K5/14 , H01M10/613 , H01M10/651 , H01M10/653
摘要： The present invention provides a thermally conductive composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a reaction rate controlling agent, wherein in measurement using a viscoelasticity measuring apparatus under conditions of 35°C, a shear mode, a frequency of 1 Hz, and a strain of 10%, a storage modulus G'1 after 3,600 seconds from the start of the measurement is 2,000 Pa or less, and a storage modulus G'2 after 7,200 seconds from the start of the measurement is 4,350 Pa or more, and wherein viscosity measured at 25°C and a shear rate of 10 rpm is 220 Pa·s or less. According to the present invention, it is possible to provide the thermally conductive composition that has good workability and maintains reliability as a product, over a relatively wide temperature range.
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公开(公告)号：EP4428199A1
公开(公告)日：2024-09-11
申请号：EP22890022.1
申请日：2022-11-04
发明人： KITADA, Gaku , KANEKO, Toshiki
摘要： The thermally conductive composition of the present invention includes a liquid polymer, a thermally conductive filler and a structural viscosity imparting agent, wherein the thermally conductive composition has a viscosity ratio (η1/η3) between a viscosity η1 measured by a rheometer under conditions of a measurement temperature of 25°C and a shear rate of 0.00252 (1/s) and a viscosity η3 measured by a rheometer under conditions of a measurement temperature of 25°C and a shear rate of 0.05432 (1/s) of more than 10. The present invention can provide a thermally conductive composition in which sedimentation of the thermally conductive filler is suppressed in storage and which has excellent handling properties in use.
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公开(公告)号：EP4410926A1
公开(公告)日：2024-08-07
申请号：EP22876404.9
申请日：2022-09-28
发明人： KITADA, Gaku
CPC分类号： Y02E60/10 , H01M10/653 , C09K5/10 , H01M10/647 , H01M10/613 , C09K5/14
摘要： A thermally conductive composition of the present invention is a composition in a liquid form at 25°C comprising an organopolysiloxane, a thermally conductive filler, and an ester compound having 12 to 28 carbon atoms. According to the present invention, it is possible to provide a thermally conductive composition, which has good workability because of its low viscosity, excellent heat resistance, and in which a low-molecular weight siloxane does not tend to be generated.
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公开(公告)号：EP4300569A1
公开(公告)日：2024-01-03
申请号：EP22759177.3
申请日：2022-01-20
发明人： IWAMOTO, Tatsuya , KITADA, Gaku
摘要： The present invention provides a thermally conductive composition comprising: (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a polysiloxane compound containing at least one alkyl group having 4 or more carbon atoms. According to the present invention, it is possible to provide the thermally conductive composition capable of forming a thermally conductive member having an excellent thermally conductive property and high adhesive force to polypropylene.
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公开(公告)号：EP3993083A1
公开(公告)日：2022-05-04
申请号：EP20832261.0
申请日：2020-06-05
发明人： OZAWA, Motoki , KITADA, Gaku
IPC分类号： H01M20060101
摘要： The present invention is a battery module comprising a case, a plurality of cells being arranged in the case and having an energy density of 200 Wh/L or more, and a heat absorbing member provided at least either between the case and the plurality of cells or between the plurality of cells, wherein the heat absorbing member has an endothermic quantity Q from 150°C to 350°C of 500 J/cm 3 or more and a thermal conductivity λ of 0.8 W/mK or more.
According to the present invention, there can be provided a battery module whose temperature hardly rises in an abnormal early period and in a certain period from abnormality occurrence.-
公开(公告)号：EP3878911A1
公开(公告)日：2021-09-15
申请号：EP19881155.6
申请日：2019-11-05
发明人： ISHIDA, Keita , KITADA, Gaku
IPC分类号： C08L101/12 , C09K5/14 , H05K7/20
摘要： There is provided a heat-conducting composition capable of forming thick films in good productivity. The heat-conducting composition contains a binder and a heat-conducting filler, wherein a first viscosity thereof is 50 to 300 Pa·s as measured at a rotating speed of 10 rpm at 25°C by using a rotational viscometer; and the ratio [second viscosity/first viscosity] of a second viscosity to the first viscosity is 3 to 8 where the second viscosity is a viscosity measured at a rotating speed of 1 rpm at 25°C by using the rotational viscometer.
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