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公开(公告)号：EP4400251A1
公开(公告)日：2024-07-17
申请号：EP24151694.7
申请日：2024-01-12
发明人： YOKOYAMA, Takahiro , YOSHIKAWA, Shunsaku , IIJIMA, Yuki , DEI, Kanta , MATSUFUJI, Takahiro , SUGISAWA, Kota , SUZUKI, Shigeto
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , B23K35/0244 , B23K35/025 , H05K3/3463
摘要： Provided are a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition consisting of, by mass%, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. Preferably, the solder alloy further contains, by mass%, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：EP4393634A1
公开(公告)日：2024-07-03
申请号：EP22876492.4
申请日：2022-09-29
摘要： Provided are: a solder alloy having excellent wettability and high reliability by suppressing breakage of a solder joint; and a solder joint. The solder alloy has an alloy composition comprising, by mass%, 1.0-3.7% of Ag, 0.4-0.8% of Cu, 0.50-2.90% of Sb, 5.00-10.00% of In, and 0.01-0.06% of Ni, with the balance being Sn.
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公开(公告)号：EP4400252A1
公开(公告)日：2024-07-17
申请号：EP24151700.2
申请日：2024-01-12
发明人： YOKOYAMA, Takahiro , YOSHIKAWA, Shunsaku , IIJIMA, Yuki , DEI, Kanta , MATSUFUJI, Takahiro , SUGISAWA, Kota , SUZUKI, Shigeto
CPC分类号： B23K35/262 , C22C13/02 , C22C13/00 , B23K35/0244 , B23K35/025 , H05K3/3463
摘要： Provided are a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition consisting of, by mass%, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: 1.1% or more and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. Preferably, the solder alloy further contains, by mass%, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：EP4400253A1
公开(公告)日：2024-07-17
申请号：EP24151702.8
申请日：2024-01-12
发明人： YOKOYAMA, Takahiro , YOSHIKAWA, Shunsaku , IIJIMA, Yuki , DEI, Kanta , MATSUFUJI, Takahiro , SUGISAWA, Kota , SUZUKI, Shigeto
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , B23K35/0244 , B23K35/025 , H05K3/3463 , H05K3/3485
摘要： Provided are a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition consisting of, by mass%, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: more than 0.008% and 0.020% or less, with the balance being Sn. Preferably, the solder alloy further contains, by mass%, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：EP4249165A1
公开(公告)日：2023-09-27
申请号：EP21894680.4
申请日：2021-11-17
摘要： The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance being made up of Sn.
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