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公开(公告)号：EP3000555B1
公开(公告)日：2020-04-22
申请号：EP14783264.6
申请日：2014-03-28
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公开(公告)号：EP3173182A1
公开(公告)日：2017-05-31
申请号：EP16200965.8
申请日：2016-11-28
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02
摘要： To provide a solder alloy capable of suppressing the occurrence of liftoff phenomena, suppressing the deterioration by thermal fatigue, and suppressing the generation of solder bridges and solder icicles in a fillet. The solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn, and a total amount of Ag and Bi being from 0.3 to 0.8%.
摘要翻译： 提供一种能够抑制剥离现象的产生，抑制因热疲劳导致的劣化，并且抑制焊脚中的焊桥和焊料棒的产生的焊料合金。 该焊料合金具有以质量％计含有Bi：0.1〜0.8％， Ag：0至0.3％; Cu：0至0.7％; P：0.001〜0.1％，余量为Sn，Ag和Bi的合计量为0.3〜0.8％。
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公开(公告)号：EP4400252A1
公开(公告)日：2024-07-17
申请号：EP24151700.2
申请日：2024-01-12
发明人： YOKOYAMA, Takahiro , YOSHIKAWA, Shunsaku , IIJIMA, Yuki , DEI, Kanta , MATSUFUJI, Takahiro , SUGISAWA, Kota , SUZUKI, Shigeto
CPC分类号： B23K35/262 , C22C13/02 , C22C13/00 , B23K35/0244 , B23K35/025 , H05K3/3463
摘要： Provided are a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition consisting of, by mass%, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: 1.1% or more and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. Preferably, the solder alloy further contains, by mass%, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：EP3173182B1
公开(公告)日：2018-08-15
申请号：EP16200965.8
申请日：2016-11-28
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02
摘要： To provide a solder alloy capable of suppressing the occurrence of liftoff phenomena, suppressing the deterioration by thermal fatigue, and suppressing the generation of solder bridges and solder icicles in a fillet. The solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn, and a total amount of Ag and Bi being from 0.3 to 0.8%.
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公开(公告)号：EP2886243B1
公开(公告)日：2018-03-14
申请号：EP12879828.7
申请日：2012-06-30
CPC分类号： H01L24/13 , B23K1/0016 , B23K35/0222 , B23K35/0261 , B23K35/26 , B23K35/262 , C22C13/00 , C22C13/02 , H01B1/02 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05155 , H01L2224/05164 , H01L2224/05644 , H01L2224/05647 , H01L2224/1301 , H01L2224/13111 , H01L2224/13147 , H01L2924/01015 , H01L2924/01026 , H01L2924/01027 , H01L2924/01028 , H01L2924/01032 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/2076 , H05K3/3457 , H05K2203/041 , H01L2924/00 , H01L2924/01029 , H01L2924/00014
摘要： A solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, which suppresses fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The present invention is a lead-free solder ball for electrodes of BGAs or CSPs consisting of 1.6 - 2.9 mass % of Ag, 0.7 - 0.8 mass % of Cu, 0.05 - 0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and excellent resistance to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. At least one element selected from Fe, Co, and Pt in a total amount of 0.003 - 0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003 - 0.1 mass % may be added to this composition.
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公开(公告)号：EP3000555A1
公开(公告)日：2016-03-30
申请号：EP14783264.6
申请日：2014-03-28
发明人： KOROKI, Motoki , YOSHIKAWA, Shunsaku , OKADA, Sakie , ITOYAMA, Taro , KOMURO, Hideyuki , HIRAI, Naoko , SHIMIZU, Keitaro
摘要： A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. Said solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. Said solder paste comprises a powdered metal component and a flux component, said powdered metal component comprising the following: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof; and a solder powder consisting primarily of tin. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.
摘要翻译： 在第二次或随后的回流加热阶段，金属不会从接点流出。 所述焊膏在室温和高温下表现出高接合强度，在时间稳定性方面优异，空隙形成最少，并且可形成高度内聚的接合部。 所述焊膏包括粉末状金属组分和助焊剂组分，所述粉末状金属组分包括以下组分：粉末状金属间化合物，其包含铜和锡，并具有覆盖其表面的金属阻挡层; 和主要由锡组成的焊料粉末。 粉末状金属间化合物和焊料粉末都不含有纯铜相，抑制了铜离子向焊剂中的溶出。
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7.发明公开LEAD-FREE SOLDER ALLOY, JOINING MEMBER AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT 有权无铅焊料合金，连接器及其制造方法和电子组件
公开(公告)号：EP2474383A1
公开(公告)日：2012-07-11
申请号：EP10813768.8
申请日：2010-09-02
发明人： YOSHIKAWA, Shunsaku , YAMANAKA, Yoshie , OHNISHI, Tsukasa , ISHIBASHI, Seiko , WATANABE, Koji , ISHIKAWA, Hiroki , CHIBA, Yutaka
IPC分类号： B23K35/26 , B23K1/08 , B23K1/20 , C22C28/00 , H01L23/373
CPC分类号： H01L23/495 , B23K35/007 , B23K35/0238 , B23K35/26 , C22C28/00 , C23C24/103 , H01L23/3736 , H01L2924/0002 , H01R43/0235 , H01L2924/00
摘要： A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1 - 3% and/or Bi: 0.1 - 2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.
摘要翻译： 本发明提供一种无铅焊料可以减少空隙的产生及使用该焊料并具有优异的粘合性，粘接强度，和可加工性的连接部件。 的无铅焊料合金具有如下组成基本上由锡的：0.1 - 3％和/或Bi：0.1 - 2％，且在和不可避免的杂质的剩余部分，且具有在时抑制空隙的发生的效果 焊接。 连接构件通过熔化无铅焊料合金，在熔体中浸渍金属制的基板，施加超声波振动，以将熔融的无铅焊料合金和金属衬底上制备，以形成表面上的无铅焊料合金层 的金属基板。 散热器和封装通过该连接部件通过回流加热在助熔剂的存在下焊接到海誓山盟。
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公开(公告)号：EP4400251A1
公开(公告)日：2024-07-17
申请号：EP24151694.7
申请日：2024-01-12
发明人： YOKOYAMA, Takahiro , YOSHIKAWA, Shunsaku , IIJIMA, Yuki , DEI, Kanta , MATSUFUJI, Takahiro , SUGISAWA, Kota , SUZUKI, Shigeto
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , B23K35/0244 , B23K35/025 , H05K3/3463
摘要： Provided are a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition consisting of, by mass%, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. Preferably, the solder alloy further contains, by mass%, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：EP4122639A1
公开(公告)日：2023-01-25
申请号：EP21771219.9
申请日：2021-03-10
发明人： IIJIMA, Yuuki , OKADA, Hiroshi , YOSHIKAWA, Shunsaku , SAITO, Takashi , DEI, Kanta , MATSUFUJI, Takahiro
摘要： Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass%, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0 ≤ Ag×Cu×Ni/P ≤ 25, 0.500 ≤ Sn×P ≤ 0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass%) in the alloy composition.
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公开(公告)号：EP3944923A1
公开(公告)日：2022-02-02
申请号：EP21188466.3
申请日：2021-07-29
摘要： A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.
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