公开(公告)号：EP4358145A1

公开(公告)日：2024-04-24

申请号：EP22825280.5

申请日：2022-06-14

申请人： Seoul Semiconductor Co., Ltd.

发明人： LEE, Woo Gun ,  GO, Young Il ,  KI, Youngsik ,  HONG, Seung Sik

IPC分类号： H01L27/15 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/56

CPC分类号： H01L25/167 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/56 ,  H01L24/98 ,  H01L2224/9220130101

摘要： A display panel is provided. A display panel according to one embodiment comprises: a panel substrate; a plurality of micro LEDs arranged on the panel substrate; and a molding part that covers the plurality of micro LEDs, wherein the molding part includes a first molding part and a second molding part disposed in an area surrounded by the first molding part, wherein the second molding part has a different composition or shape from the first molding part, and surrounds a side surface of at least one of the plurality of micro LEDs.

公开(公告)号：EP4304304A1

公开(公告)日：2024-01-10

申请号：EP22763615.6

申请日：2022-03-03

申请人： Seoul Semiconductor Co., Ltd.

发明人： KI, Youngsik ,  HONG, Seung Sik

IPC分类号： H05K3/28 ,  H05K3/00 ,  H01L27/12 ,  H01L25/16

摘要： A circuit board according to one or more embodiments of the present disclosure comprises: a base having a plurality of wirings on the upper surface thereof; a first photosensitive solder resist (PSR) which covers the wirings, and in which a pad open area exposing portions of the wirings is defined; and a second PSR which covers the first PSR and has an opening portion exposing the pad open area, wherein the opening portion of the second PSR is larger than the pad open area of the first PSR.