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1.发明公开
公开(公告)号：EP3730532A1
公开(公告)日：2020-10-28
申请号：EP20166824.1
申请日：2020-03-30
发明人： SHE, Naidong , HUANG, Zengbiao
摘要： The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.
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2.发明公开
公开(公告)号：EP3733594A1
公开(公告)日：2020-11-04
申请号：EP18896498.5
申请日：2018-03-23
发明人： HUANG, Zengbiao
摘要： Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.
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公开(公告)号：EP3231829B1
公开(公告)日：2019-10-30
申请号：EP15868567.7
申请日：2015-05-27
发明人： DENG, Huayang , HUANG, Zengbiao , LIU, Qianfa , YANG, Zhongqiang , WANG, Peng
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4.发明公开DEGRADABLE RESIN COMPOSITION, AND PREPREG, LAMINATE AND COPPER CLAD LAMINATE USING SAME, AND DEGRADING METHOD THEREOF 有权可降解树脂组合物，以及使用该组合物的预浸料，层压物和铜箔层压物及其降解方法
公开(公告)号：EP3231829A1
公开(公告)日：2017-10-18
申请号：EP15868567.7
申请日：2015-05-27
发明人： DENG, Huayang , HUANG, Zengbiao , LIU, Qianfa , YANG, Zhongqiang , WANG, Peng
摘要： Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufaturing the copper clad laminate, and the manufatured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.
摘要翻译： 本发明公开了一种树脂组合物，以及使用该树脂组合物的预浸料坯，层压板和覆铜箔层压板及其分解方法，所述树脂组合物包含：环氧树脂，可降解胺固化剂，可降解硫醇固化剂和无机填料。 由该树脂组合物制造的覆铜层压板包括多块堆叠的预浸料坯，以及在堆叠的预浸料坯的一侧或两侧布置的铜箔，每个预浸料坯包含增强材料并且在浸泡和干燥之后将树脂组合物粘附于其上。 本发明将可降解胺固化剂与可降解硫醇固化剂混合，得到反应速率可调的固化体系，有利于制作覆铜箔层压板时的工艺控制，且生产性能好的覆铜箔层压板整体性能高，完全 可降解，从而回收利用每一种有效成分。
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