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公开(公告)号:EP3722091B1
公开(公告)日:2023-11-15
申请号:EP18885222.2
申请日:2018-12-07
发明人: ASHIBA, Kouji , OOWASHI, Keigo , KOUKAMI, Aki , ZHANG, Rui
IPC分类号: B32B15/08 , B32B27/20 , H01L23/373 , B32B3/10 , B32B15/00 , B32B15/092 , B32B27/26 , B32B27/28 , B32B27/38
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公开(公告)号:EP3575078B1
公开(公告)日:2023-10-25
申请号:EP18767633.3
申请日:2018-02-21
IPC分类号: B32B15/092 , B32B15/08 , C09D5/00 , C09D123/26 , C09D163/00 , C09J123/26 , C09J163/00 , C23C26/00 , B32B7/12 , B32B15/085 , B29C45/14 , C09J7/20 , C09D151/06 , C08G59/40
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3.
公开(公告)号:EP4169992A1
公开(公告)日:2023-04-26
申请号:EP21825066.0
申请日:2021-06-17
IPC分类号: C09D163/00 , C09D201/00 , B32B15/092 , H01F1/18 , C23C22/00 , H01F27/245 , H02K1/04
摘要: A coating composition for an electrical steel sheet including an epoxy resin, a latent epoxy resin curing agent, and a thermoplastic elastomer, wherein the thermoplastic elastomer has a melting point of 100°C or higher and 200°C or lower and a bending elastic modulus of more than 5 MPa and 100 MPa or less, and wherein the amount of the thermoplastic elastomer with respect to a total amount of 100 parts by mass of the epoxy resin and the latent epoxy resin curing agent is 10 parts by mass or more and less than 40 parts by mass.
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公开(公告)号:EP3495438B1
公开(公告)日:2022-05-04
申请号:EP17836950.0
申请日:2017-08-01
IPC分类号: C09D201/08 , C09D7/40 , B32B15/092 , C23C26/00 , C09D5/25 , C09D163/10
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公开(公告)号:EP3670173B1
公开(公告)日:2022-02-16
申请号:EP19217040.5
申请日:2019-12-17
发明人: UTSOGN, Tor Sigbjørn
IPC分类号: B32B1/08 , B32B3/26 , B32B3/30 , B32B13/12 , B32B15/08 , B32B15/082 , B32B15/085 , B32B15/092 , B32B15/095 , B32B15/18 , B32B27/20 , E04H12/02
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公开(公告)号:EP3858605A1
公开(公告)日:2021-08-04
申请号:EP19866267.8
申请日:2019-09-27
发明人: KOORI, Masumi , UEDA, Kohei , MORISHITA, Atsushi , KOGA, Atsuo
IPC分类号: B32B15/08 , B32B15/09 , B32B15/092 , B32B15/095 , B32B15/18 , C23C26/00 , C23C28/00
摘要: This adhesively joined structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion includes an organic resin phase containing one or more of a urethane group, an epoxy group, and an ester group; an organic compound phase formed of an organic silicon compound; and optionally an inorganic compound phase formed of an inorganic silicon compound. The total volume percentage of the organic compound phase and the inorganic compound phase to the total volume of the film portion is 16 vol% to 84 vol%. The volume percentage of the organic compound phase to the total volume of the film portion is 16 vol% to 84 vol%. The volume percentage of the inorganic compound phase to the total volume of the film portion is limited to 10 vol% or less. The organic silicon compound includes a Si-C bond; and a Si-O bond or a Si-OH bond or a a combination thereof.
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公开(公告)号:EP2692526B1
公开(公告)日:2020-10-28
申请号:EP12762807.1
申请日:2012-02-24
IPC分类号: B32B15/092 , H01L23/00 , C09J7/20 , B32B27/20
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公开(公告)号:EP3012294B1
公开(公告)日:2020-09-16
申请号:EP14814473.6
申请日:2014-06-16
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公开(公告)号:EP3279266B1
公开(公告)日:2019-08-07
申请号:EP16771951.7
申请日:2016-02-19
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