摘要:
A photomask blank includes a chromium-based material film as a hard mask film containing at least one selected from the group consisting of nitrogen, oxygen, carbon and hydrogen, wherein a ratio (A/B) of etching rates per unit film thickness is in a range from 0.7 to 0.9, and the chromium-based material film has a tensile stress or compressive stress corresponding to an amount of warp of up to 70 nm. The present invention provides a photomask blank having a thin film of chromium-based material which is enhanced in etch resistance and lowered in film stress. This enables high-accuracy patterning of a chromium-based material film.
摘要:
A photomask blank (11) has a transparent substrate (10), an optional first film (1), a second film (2), a third film (3), and a fourth film (4). The first and third films are formed of silicon-containing materials which are resistant to chlorine base dry etching and removable by fluorine base dry etching. The second and fourth films are formed of chromium-containing materials which are resistant to fluorine base dry etching and removable by chlorine base dry etching. An etching clear time of the fourth film is longer than an etching clear time of the second film, on chlorine base dry etching. The fourth film (4) assists in forming an outer frame pattern (3F,4F) of a photomask.
摘要:
In a photomask blank comprising a transparent substrate, a resistance layer, and a conductive layer, the resistivity and thickness of the conductive layer and the resistivity and thickness of the resistance layer are selected so as to meet a specific equation (1). In EB lithography, a ground can be established at a necessary fully low resistance value, and EB writing be carried out at a high accuracy.
摘要:
In the chromium-containing material film of the present invention, an element is added thereto and is capable of bringing a mixture of the element and the chromium into a liquid phase at a temperature of 400°C or lower. The use of such a chromium-containing material film as an optical film (e.g., a light-shielding film, an etching mask film, or an etching stopper film) of a photo mask blank can achieve an improvement in chlorine-dry etching while retaining the same optical characteristics and the like as those of the conventional chromium-containing material film, thereby increasing the patterning precision.
摘要:
A halftone phase shift photomask blank has on a transparent substrate (10) a first film (1) serving as a halftone phase shift film, a second film (2) serving as a light shielding film, a third film (3) serving as a hard mask film, and a fourth film (4). The first and third films are formed of silicon-containing materials which are resistant to chlorine base dry etching and removable by fluorine base dry etching. The second and fourth films are formed of silicon-free, chromium-containing materials which are resistant to fluorine base dry etching and removable by chlorine base dry etching.
摘要:
An inorganic material film containing tin within the concentration range of 0.1 atomic percent or higher but no higher than 11.5 atomic percent eliminates the problem in which tin localizes and forms into particles, with the result that these particles turn into defects in an optical film. An inorganic material film for a photomask blank according to the present invention film-formed by sputtering and composed of a chromium-containing material includes a light-shielding layer having electrical conductivity, wherein the light-shielding layer contains 0.1 atomic percent or higher but no higher than 11.5 atomic percent of tin and no higher than 15 atomic percent of oxygen. The lower limit of oxygen concentration is, for example, 3 atomic percent. The inorganic material film has electrical conductivity, which is preferably no higher than 5000 Ω/cm 2 when evaluated in terms of resistance values.
摘要翻译:含有浓度范围为0.1原子%以上且不高于11.5原子%的锡的无机材料膜消除了锡定位并形成颗粒的问题,结果是这些颗粒变成光学膜的缺陷。 根据本发明的用于通过溅射成膜并由含铬材料构成的用于光掩模坯料的无机材料膜包括具有导电性的遮光层,其中遮光层包含0.1原子%以上但不含 高于11.5原子%的锡和不高于15原子%的氧气。 氧浓度的下限例如为3原子%。 无机材料膜具有导电性,当根据电阻值进行评估时,其优选不高于5000Ω/ cm 2。
摘要:
A photomask blank includes a chromium-based material film as a hard mask film containing at least one selected from the group consisting of nitrogen, oxygen, carbon and hydrogen, wherein a ratio (A/B) of etching rates per unit film thickness is in a range from 0.7 to 0.9, and the chromium-based material film has a tensile stress or compressive stress corresponding to an amount of warp of up to 70 nm. The present invention provides a photomask blank having a thin film of chromium-based material which is enhanced in etch resistance and lowered in film stress. This enables high-accuracy patterning of a chromium-based material film.