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1.发明授权
公开(公告)号：EP1319690B1
公开(公告)日：2006-10-04
申请号：EP02258457.7
申请日：2002-12-09
发明人： Tetsuka, Hiroaki, Shin-Etsu Chemical Co., Ltd. , Yamada, Kunihiro, Shin-Etsu Chemical Co., Ltd. , Mita, Kunihiko, Shin-Etsu Chemical Co., Ltd.
CPC分类号： C10M111/04 , C08G77/12 , C08G77/20 , C08L83/04 , C10M2201/053 , C10M2201/0623 , C10M2203/06 , C10M2205/20 , C10M2207/021 , C10M2207/20 , C10M2227/04 , C10M2229/0435 , C10M2229/0445 , C10N2210/07 , C10N2220/082 , C10N2240/20 , C10N2250/10 , H01L2224/73253 , C08L83/00 , C10N2210/03 , C10N2210/05 , C10N2210/04 , C10N2210/02
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2.发明公开
公开(公告)号：EP1319690A2
公开(公告)日：2003-06-18
申请号：EP02258457.7
申请日：2002-12-09
发明人： Tetsuka, Hiroaki, Shin-Etsu Chemical Co., Ltd. , Yamada, Kunihiro, Shin-Etsu Chemical Co., Ltd. , Mita, Kunihiko, Shin-Etsu Chemical Co., Ltd.
CPC分类号： C10M111/04 , C08G77/12 , C08G77/20 , C08L83/04 , C10M2201/053 , C10M2201/0623 , C10M2203/06 , C10M2205/20 , C10M2207/021 , C10M2207/20 , C10M2227/04 , C10M2229/0435 , C10M2229/0445 , C10N2210/07 , C10N2220/082 , C10N2240/20 , C10N2250/10 , H01L2224/73253 , C08L83/00 , C10N2210/03 , C10N2210/05 , C10N2210/04 , C10N2210/02
摘要： This invention discloses a thermoconducting silicone composition comprising the following components (A)-(F), whereof the viscosity at 25°C before curing is 10-1000 Pa·s, a method of installing this composition, a heat dissipating structure of a semiconductor device using the same, and a cured material formed by heating this composition in two steps.
Component (A): 100 weight parts of an organopolysiloxane having at least two alkenyl groups in the molecule, and a viscosity of 10-100,000 mm 2 /s at 25°C,
Component (B): An organohydrogenpolysiloxane having at least two hydrogen atoms bonded directly to silicon atoms in the molecule, in an amount such that (total number of hydrogen atoms bonded directly to silicon atoms/total number of alkenyl groups in Component (A)) is 0.5-5.0,
Component (C): A low melting metal powder having a melting point of 40-250°C, and an average particle size of 0.1-100 micrometers,
Component (D): A highly thermoconducting filler having a melting point of more than 250°C, and an average particle size of 0.1-100 micrometers,
the total amount of component (C) and Component (D) being 800-2,200 weight parts, and (C)/((C)+(D)) = 0.05-0.9,
Component (E): A catalytic platinum selected from a group comprising platinum and platinum compounds, 0.1-500ppm relative to Component (A) calculated in terms of platinum atom,
Component (F): 0.001-5 weight parts of a controlling agent which suppresses the catalytic activity of Component (E).
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