摘要:
Provided is a capacitive input switch capable of being accommodated in a housing of equipment or the like appropriately and effectively suppressing conduction failure associated with three dimensional formation. In a capacitive input switch that is accommodated in a housing of electronic equipment, comprises a rigidity imparting layer 1 having rigidity and a laminate sheet 10 laminated on the rigidity imparting layer 1 to be applied with strength, and has the rigidity imparting layer 1 and the laminate sheet 10 three dimensionally formed, the laminate sheet 10 is formed by a substrate sheet 11, a conductive pattern layer 12 for capacitor formation and a decorative layer 13 that is laminated at least on any one of the substrate sheet 11 and the conductive pattern layer 12, a separate conductor 30 is caused to contact with the conductive pattern layer 12, and the conductive pattern layer 12 is caused to be electrically connected to an external electric circuit by the conductor 30. The conductor 30 comprised of a conductive rubber is used and used for extending to the external electric circuit, so that when the capacitive input switch is accommodated in the housing of the electronic equipment, an extraction line never occupies a space to be an obstacle to accommodation.
摘要:
A production method of a capacitive sensor sheet, comprising: a film forming step forming of a optically-transparent electroconductive film 11 on the surface of a substrate 2 having optical transparency; a supplemental electrode forming step of setting an electrode region 3a which functions as the transparent electrode3 at least in part of the film 11, and laminating a supplemental electrode4a which has a lower electrical resistance than the electrical resistance of the film 11 to cover at least part of a periphery of the electrode region 3a; a wire forming step of laminating a wire 4b in which one end thereof is connected to the supplemental electrode 4a on the film11; a resist laminating step of laminating a resist 12 to cover all of the electrode region 3a and at least part of the supplemental electrode 4a; and a conductive film removing step of removing a part of the film11 formed on the substrate 2 having optical transparency placed at a position not overlapping with the resist 12, the supplemental electrode 4a , or the wire 4b.