公开(公告)号：EP4184560A1

公开(公告)日：2023-05-24

申请号：EP22206548.4

申请日：2022-11-10

申请人： Shinko Electric Industries Co., Ltd.

发明人： NAKAZAWA, Katsuya

IPC分类号： H01L23/045 ,  H01L23/00 ,  H01S5/02212 ,  H01S5/0231

摘要： A header for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a through hole penetrating the eyelet from the first surface to the second surface, a lead inserted through the through hole, and a metal base bonded to the second surface of the eyelet. The lead is bent at the second surface of the eyelet and protrudes from the side surface of the eyelet in a plan view. The metal base is spaced apart from the lead. The lead, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base in a side view.