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    HEADER FOR SEMICONDUCTOR PACKAGE
    2.
    发明公开
    HEADER FOR SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：EP4184560A1

    公开(公告)日：2023-05-24

    申请号：EP22206548.4

    申请日：2022-11-10

    申请人： Shinko Electric Industries Co., Ltd.

    发明人： NAKAZAWA, Katsuya

    IPC分类号： H01L23/045 ,  H01L23/00 ,  H01S5/02212 ,  H01S5/0231

    摘要： A header for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a through hole penetrating the eyelet from the first surface to the second surface, a lead inserted through the through hole, and a metal base bonded to the second surface of the eyelet. The lead is bent at the second surface of the eyelet and protrudes from the side surface of the eyelet in a plan view. The metal base is spaced apart from the lead. The lead, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base in a side view.

    COMPACT LASER LIGHT ASSEMBLY
    5.
    发明公开
    COMPACT LASER LIGHT ASSEMBLY 审中-公开

    公开(公告)号：EP4009455A1

    公开(公告)日：2022-06-08

    申请号：EP21210614.0

    申请日：2021-11-25

    申请人： Honeywell International Inc.

    发明人： VANKAYALA, Gowtham ,  SURE, Anita ,  MURUGESAN, Gokul ,  STEPHENS, Newel ,  GIFFEN, Craig

    IPC分类号： H01S5/00 ,  H01S5/323 ,  H01S5/02212 ,  H01S5/40 ,  F21Y115/30

    摘要： A laser light assembly includes a substrate, a reflective phosphor plate, a plurality of laser diodes, a light shield, at least one mirror, a plurality of beam-shaping lenses, and a first lens. The reflective phosphor plate is coupled to the substrate and converts incident blue laser light into white light. The laser diodes emit the blue laser light. The light shield prevents the blue laser light emitted by the laser diodes from escaping the assembly. The mirror reflects the blue laser light emitted from each laser diode toward a predetermined position on the reflective phosphor plate, whereby the reflective phosphor plate emits white light. The beam-shaping lenses are disposed between a different one of the laser diodes and the mirror. The first lens receives the white emitted from the reflective phosphor plate.

    ELECTRONIC COMPONENT PACKAGE AND THE MANUFACTURING METHOD THEREOF
    8.
    发明公开
    ELECTRONIC COMPONENT PACKAGE AND THE MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：EP4318829A1

    公开(公告)日：2024-02-07

    申请号：EP23189991.5

    申请日：2023-08-07

    申请人： Arima Lasers Corp.

    发明人： MI, CHUN-WEI

    IPC分类号： H01S5/02212 ,  H01S5/02345 ,  H01S5/062

    摘要： The present invention relates to a new electronic component package and its manufacturing method, especially the package of an optoelectronic component. The package comprises an electronically conductive base, an electronically conductive cap, and at least one electronic component. The base has an upper surface, a lower surface, and at least one through hole sealed with a conducting feedthrough surrounded by a ring of insulating material. The electronic component is fixed on the upper surface of the base and is electrically connected to the conducting feedthroughs and/or the base. The base and the cap are sealed by welding.