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公开(公告)号：EP2234153A1
公开(公告)日：2010-09-29
申请号：EP08853285.8
申请日：2008-11-25
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , B60L1/003 , B60L3/003 , B60L2240/36 , B60L2240/525 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： A casing of a liquid-cooled-type cooling device has a peripheral wall including mutually facing right and left side walls. A cooling-liquid inlet is formed at one end of the right side wall, and a cooling-liquid outlet is formed at an end of the left side wall corresponding to the other end of the right side wall. A parallel-flow-channel section is provided within the casing to be located between the left and right side walls and between the cooling-liquid inlet and outlet and includes flow channels through which cooling liquid flows. Internal regions of the casing located upstream and downstream of the parallel-flow-channel section serve as inlet and outlet header sections, respectively. The cross-sectional area of the inlet header section reduces from the cooling-liquid inlet toward the left side wall. The outlet and inlet header sections are asymmetric in shape with respect to the width direction of the parallel-flow-channel section.
摘要翻译： 液冷式冷却装置的壳体具有包括相互面对的左右侧壁的周壁。 在右侧壁的一端形成有冷却液入口，在左侧壁的与右侧壁的另一端对应的端部形成冷却液出口。 壳体内设有平行流道部分，位于左右侧壁之间，冷却液入口和出口之间，并包括冷却液流过的流动通道。 位于平行流道部分的上游和下游的壳体的内部区域分别用作入口和出口集管部分。 入口集管部分的横截面积从冷却液入口朝向左侧壁减小。 出口和入口集管部分相对于平行流道部分的宽度方向的形状是不对称的。
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公开(公告)号：EP2003691B1
公开(公告)日：2019-01-09
申请号：EP07737994.9
申请日：2007-03-08
申请人： Showa Denko K.K.
发明人： TOH, Keiji , MORI, Shogo , OBARA, Hideyasu , WAKABAYASHI, Nobuhiro , NAKAGAWA, Shintaro , YAMAUCHI, Shinobu
IPC分类号： H01L23/473 , H01L23/40 , H01L23/367 , H01L23/373 , H01L25/07
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公开(公告)号：EP2003691A2
公开(公告)日：2008-12-17
申请号：EP07737994.9
申请日：2007-03-08
发明人： TOH, Keiji , MORI, Shogo , OBARA, Hideyasu , WAKABAYASHI, Nobuhiro , NAKAGAWA, Shintaro , YAMAUCHI, Shinobu
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/3677 , H01L23/3735 , H01L23/4006 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： A power module base 1 includes a heat radiation substrate 2 formed of a high-thermal-conduction material, an insulating substrate 3 joined to an upper surface of the heat radiation substrate 2, a wiring layer 8 provided on an upper surface of the insulating substrate 3, and a heat radiation fin 4 joined to a lower surface of the heat radiation substrate 2. A component attachment plate 5 which is thicker than the heat radiation substrate 2 and has a through hole 11 for accommodating the insulating substrate 3 is joined to the upper surface of the heat radiation substrate 2 such that the insulating substrate 3 is located within the through hole 11. This power module base 1 can maintain the upper surface of the component attachment plate 5 flat, and various components required for a power module, such as a casing 13, can be attached onto the component attachment plate 5.
摘要翻译： 功率模块基座1包括由高导热材料形成的散热基板2，与散热基板2的上表面接合的绝缘基板3，设置在绝缘基板的上表面的布线层8 3和散热片4接合到散热基板2的下表面。比散热基板2厚且具有用于容纳绝缘基板3的通孔11的部件安装板5接合到 散热基板2的上表面，使得绝缘基板3位于通孔11内。该功率模块基座1可以将部件安装板5的上表面保持平坦，并且将功率模块所需的各种部件 作为壳体13，可以附接到部件安装板5上。
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公开(公告)号：EP2234153B1
公开(公告)日：2019-07-03
申请号：EP08853285.8
申请日：2008-11-25
申请人： Showa Denko K.K.
IPC分类号： H01L23/473 , H05K7/20 , B60L1/00 , B60L3/00
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公开(公告)号：EP2003691A9
公开(公告)日：2009-04-22
申请号：EP07737994.9
申请日：2007-03-08
发明人： TOH, Keiji , MORI, Shogo , OBARA, Hideyasu , WAKABAYASHI, Nobuhiro , NAKAGAWA, Shintaro , YAMAUCHI, Shinobu
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/3677 , H01L23/3735 , H01L23/4006 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： A power module base 1 includes a heat radiation substrate 2 formed of a high-thermal-conduction material, an insulating substrate 3 joined to an upper surface of the heat radiation substrate 2, a wiring layer 8 provided on an upper surface of the insulating substrate 3, and a heat radiation fin 4 joined to a lower surface of the heat radiation substrate 2. A component attachment plate 5 which is thicker than the heat radiation substrate 2 and has a through hole 11 for accommodating the insulating substrate 3 is joined to the upper surface of the heat radiation substrate 2 such that the insulating substrate 3 is located within the through hole 11. This power module base 1 can maintain the upper surface of the component attachment plate 5 flat, and various components required for a power module, such as a casing 13, can be attached onto the component attachment plate 5.
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