公开(公告)号：EP4443718A1

公开(公告)日：2024-10-09

申请号：EP24168552.8

申请日：2024-04-04

Applicant: Hamilton Sundstrand Corporation

Inventor： JOSHI, Ashutosh ,  CARTER, Eric A. ,  SAXBY, Coralyn J. ,  GAUVIN, Randy P. ,  PATEL, Dhaval S. ,  DeVITO, Michael J.

IPC: H02K9/19 ,  H02K9/22 ,  H02K11/30 ,  H01L23/473 ,  H01L23/44 ,  H01L23/48 ,  H02K11/05 ,  H01L23/367 ,  H01L23/40

CPC classification number: H01L23/473 ,  H01L23/44 ,  H01L23/3677 ,  H01L23/4006 ,  H02K11/05 ,  H01L24/72 ,  H02K11/30 ,  H02K9/19 ,  H02K9/223

Abstract: A rectifier diode assembly is provided and includes first and second bus bars, a diode (130)interposed between the first and second bus bars to define first and second spaces for fluid flow between the diode (130)and the first and second bus bars, respectively, and first and second louvers (150). The first louvers (140) are compressively interposed between the first bus bar and the diode (130)to extend across the first space for thermally and electrically connecting the first bus bar and the diode. The second louvers (150) are compressively interposed between the second bus bar and the diode (130)to extend across the second space for thermally and electrically connecting the second bus bar and the diode.

公开(公告)号：EP3832884B1

公开(公告)日：2024-08-14

申请号：EP20207764.0

申请日：2020-11-16

IPC: H01L23/367 ,  H01L23/482 ,  H01L23/498 ,  H01L23/00 ,  H03F1/02 ,  H03F3/195 ,  H03F3/24 ,  H01L23/66 ,  H01L23/495

CPC classification number: H03F1/0288 ,  H03F3/195 ,  H01L23/66 ,  H03F2200/22220130101 ,  H03F2200/38720130101 ,  H03F2200/45120130101 ,  H03F3/245 ,  H01L23/4824 ,  H01L2223/661120130101 ,  H01L2224/4824720130101 ,  H01L2924/1531120130101 ,  H01L2924/1531320130101 ,  H01L2224/4822720130101 ,  H01L2224/1614520130101 ,  H01L2224/3214520130101 ,  H01L2225/0651320130101 ,  H01L2225/065120130101 ,  H01L2225/0656820130101 ,  H01L2223/665520130101 ,  H01L23/3677 ,  H01L23/49861 ,  H01L23/49541 ,  H01L2224/3222720130101 ,  H01L2224/4911220130101 ,  H01L2224/4917320130101 ,  H01L24/48 ,  H01L2224/7326520130101

公开(公告)号：EP4406025A1

公开(公告)日：2024-07-31

申请号：EP22769480.9

申请日：2022-08-23

Applicant: QUALCOMM INCORPORATED

Inventor： FENG, Chien-Te ,  YIN, Wen ,  SALMON, Jay Scott

IPC: H01L25/16 ,  H01L23/36 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L25/16 ,  H01L23/552 ,  H01L2224/7325320130101 ,  H01L2924/1532120130101 ,  H01L2924/1816120130101 ,  H01L2224/040120130101 ,  H01L2224/0402620130101 ,  H01L2924/302520130101 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/3677 ,  H01L2224/1622720130101 ,  H01L2224/3224520130101 ,  H01L2224/0556820130101 ,  H01L2224/8381520130101 ,  H01L2224/8181520130101 ,  H01L2224/9222520130101 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/73 ,  H01L24/29 ,  H01L24/13 ,  H01L24/05 ,  H01L23/5383 ,  H01L23/5384

公开(公告)号：EP4300576A3

公开(公告)日：2024-06-26

申请号：EP23209817.8

申请日：2017-12-22

Applicant: At&S (China) Co., Ltd.

Inventor： TAY, Seok Kim (Annie) ,  TUOMINEN, Mikael Andreas ,  BAFTIRI, Artan

IPC: H05K1/18 ,  H05K1/02 ,  H01L23/538 ,  H01L23/48 ,  H05K3/30 ,  H05K3/46 ,  C09J7/00

CPC classification number: H05K1/0204 ,  H05K1/185 ,  H05K3/4652 ,  H05K2201/1041620130101 ,  H05K2201/207220130101 ,  H05K2201/20920130101 ,  H05K2203/06320130101 ,  C09J7/00 ,  H05K2201/02620130101 ,  H05K2201/032320130101 ,  H05K2203/019120130101 ,  C09J2203/32620130101 ,  H05K2201/0912720130101 ,  H01L2224/1820130101 ,  H01L23/49822 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49894 ,  C09J2301/3120200801

Abstract: A component carrier (106), comprising a stack (116) comprising at least one electrically conductive layer structure (114) and/or at least one electrically insulating layer structure (112), a sheet (100) with nano- and/or microstructures (102) and arranged on and/or in the stack (116), said sheet (100) comprising or consisting of copper.

公开(公告)号：EP4059049B1

公开(公告)日：2024-06-19

申请号：EP20797059.1

申请日：2020-10-19

IPC: H01L23/373 ,  H01L23/367

CPC classification number: C04B37/021 ,  H01L23/49838 ,  H01L23/3735 ,  H01L23/3677 ,  C04B37/026 ,  C04B2237/34320130101 ,  C04B2237/36620130101 ,  C04B2237/36820130101 ,  C04B2237/36520130101 ,  C04B2237/3420130101 ,  C04B2237/34820130101 ,  C04B2237/40720130101 ,  C04B2237/40220130101 ,  C04B37/025 ,  C04B2237/5420130101 ,  C04B2237/1220130101 ,  C04B2237/12420130101 ,  C04B2237/12520130101 ,  C04B2237/12720130101 ,  C04B2237/12620130101 ,  C04B2237/8620130101

公开(公告)号：EP4376070A1

公开(公告)日：2024-05-29

申请号：EP23212198.8

申请日：2023-11-27

Applicant: Infineon Technologies Austria AG

Inventor： SCHWAB, Stefan ,  JÜRSS, Michael ,  SCHARF, Thorsten

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433

CPC classification number: H01L23/4334 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/49562 ,  H01L23/3677 ,  H01L25/105

Abstract: A semiconductor package includes a semiconductor die thermally coupled to a planar metal pad, an encapsulant body that encapsulates the semiconductor die and includes a recess that extends from an outer upper side of the encapsulant body towards a rear side of the planar metal pad, and an insert arranged within the recess that is thermally coupled to the planar metal pad and extends to the outer upper side of the encapsulant body, wherein the insert that is arranged within the recess includes a curable polymer compound.

公开(公告)号：EP3825118B1

公开(公告)日：2024-05-22

申请号：EP20207430.8

申请日：2020-11-13

IPC: B32B15/01 ,  B32B3/00 ,  B32B37/00 ,  H01L23/373 ,  H05K7/20

CPC classification number: H01L23/3677 ,  H01L23/3735 ,  B32B15/017 ,  B32B15/016 ,  B32B2250/0320130101 ,  B32B2307/30220130101 ,  B32B15/20 ,  B32B9/005 ,  B32B9/041 ,  B32B3/085 ,  B32B2250/4020130101

公开(公告)号：EP4369390A1

公开(公告)日：2024-05-15

申请号：EP22207205.0

申请日：2022-11-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Muller, Philippe

IPC: H01L23/367 ,  B81B7/00

CPC classification number: H01L23/3677 ,  B81B2203/012720130101 ,  B81B7/0093 ,  H01L23/49827

Abstract: The disclosure relates to the cooling of a semiconductor device. The semiconductor device comprises an active section, an interposer section arranged on the active section, and one or more nanoelectromechanical systems or microelectromechanical systems contact switches arranged between the interposer section and the active section, wherein the interposer section comprises one or more vias, wherein each contact switch of the one or more contact switches comprises a graphene membrane, and wherein each contact switch of the one or more contact switches is configured to be switched between a first switching state, in which the graphene membrane of the contact switch is thermally connected to a respective via of the one or more vias of the interposer section and a second switching stage, in which the graphene membrane of the contact switch is thermally disconnected from the respective via of the one or more vias of the interposer section.

公开(公告)号：EP3127151B1

公开(公告)日：2024-05-01

申请号：EP15773393.2

申请日：2015-03-30

IPC: H01L23/34 ,  H01L23/48 ,  H01L25/00 ,  H01L25/18 ,  H01L25/065 ,  H01L23/00 ,  H01L23/552 ,  H01L23/498 ,  H01L23/367 ,  H01L23/522

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/1302520130101 ,  H01L2224/13120130101 ,  H01L2224/1311120130101 ,  H01L2224/1312420130101 ,  H01L2224/1314720130101 ,  H01L2224/1315520130101 ,  H01L2224/13320130101 ,  H01L2224/1614620130101 ,  H01L2224/1622720130101 ,  H01L2224/1718120130101 ,  H01L2224/3214520130101 ,  H01L2224/3222520130101 ,  H01L2224/7320420130101 ,  H01L2224/7325320130101 ,  H01L2224/9212520130101 ,  H01L2225/0651720130101 ,  H01L2225/0658920130101 ,  H01L2924/1025320130101 ,  H01L2924/103320130101 ,  H01L2924/1420130101 ,  H01L2924/143620130101 ,  H01L2924/143720130101 ,  H01L2924/143820130101 ,  H01L2924/1515620130101 ,  H01L2924/1519220130101 ,  H01L2924/1531120130101 ,  H01L2924/1532120130101 ,  H01L2924/1615220130101 ,  H01L2924/1625120130101 ,  H01L2924/1904120130101 ,  H01L2924/1904220130101 ,  H01L2924/1904320130101 ,  H01L2924/1910520130101 ,  H01L2224/132920130101 ,  H01L2225/0651320130101 ,  H01L2225/0654120130101 ,  H01L2225/0656520130101 ,  H01L2225/0656820130101 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/18 ,  H01L24/17 ,  H01L25/50 ,  H01L2924/143120130101 ,  H01L2924/143420130101 ,  H01L2924/1533120130101

公开(公告)号：EP1913633B1

公开(公告)日：2018-11-14

申请号：EP06788428.8

申请日：2006-07-25

Applicant: NXP USA, Inc.

Inventor： HESS, Kevin J. ,  LEE, Chu-Chung

IPC: H01L23/28 ,  H01L23/367

CPC classification number: H01L23/50 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73207 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors may be bond wires or conductive stud bumps and do not extend beyond a lateral edge of the die. One or more of the thermal conductors may be looped within the encapsulant and exposed at an upper surface of the encapsulant. In one form a heat spreader (68) is placed overlying the encapsulant for further heat removal. In another form the heat spreader functions as a power or ground terminal directly to points interior to the die via the thermal conductors. Active bond pads may be placed exclusively along the die's periphery or also included within the interior of the die.