公开(公告)号：EP2447293A1

公开(公告)日：2012-05-02

申请号：EP09846551.1

申请日：2009-11-19

申请人： Showa Denko K.K. ,  Toyota Jidosha Kabushiki Kaisha

发明人： ISHIUCHI, Ryujin ,  TAMURA, Akifumi ,  KANEOKA, Hidekazu ,  SUGITA, Hiroaki

IPC分类号： C08F283/01 ,  H02K3/30 ,  H02K5/08

CPC分类号： H02K3/30 ,  C08F299/0485 ,  C08J5/24 ,  C08J2367/06 ,  C08K3/22 ,  C08K5/098 ,  C08K5/13 ,  C08K5/14 ,  C08K7/14 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/014 ,  C08L25/06 ,  C08L33/12 ,  C08L67/06 ,  H02K5/08

摘要： Provided is an unsaturated polyester resin composition comprising 100 parts by mass of an unsaturated polyester resin (a) 400 to 1,000 parts by mass of a mixture of an inorganic filler (b) having a thermal conductivity coefficient of 20 W/m·K or more and aluminum hydroxide (c); 20 to 300 parts by mass of a glass fiber (d) having a fiber length of 1.5 mm or less; and 15 to 50 parts by mass of a low profile additive (e), the inorganic filler (b) and the aluminum hydroxide (c) being mixed at a mass ratio of 80:20 to 20:80, in which the unsaturated polyester resin composition further includes an alkyl peroxyalkylate-based curing agent (f) represented by the following formula (1):

wherein R represents an alkyl group; and R' represents an alkyl group having 3 or more carbon atoms, and a polymerization inhibitor (g). The unsaturated polyester resin composition yields a cured product having a low shrinkage ratio, a low linear expansion coefficient, and a high thermal conductivity coefficient, and is excellent in in-mold flowability and curability.

摘要翻译： 提供一种不饱和聚酯树脂组合物，其包含100质量份不饱和聚酯树脂（a）400至1,000质量份的导热系数为20W / m·K以上的无机填料（b）的混合物 和氢氧化铝（c）; 20〜300质量份的纤维长度为1.5mm以下的玻璃纤维（d） 和15〜50质量份的低分子添加剂（e），无机填料（b）和氢氧化铝（c）以80:20〜20:80的质量比混合，其中不饱和聚酯树脂 组合物还包含由下式（1）表示的烷基过氧烷基化物基固化剂（f）：其中R表示烷基; R'表示碳原子数3以上的烷基，阻聚剂（g）。 不饱和聚酯树脂组合物产生具有低收缩率，低线性膨胀系数和高导热系数的固化产物，并且模内流动性和固化性优异。

公开(公告)号：EP2447293B1

公开(公告)日：2014-06-04

申请号：EP09846551.1

申请日：2009-11-19

申请人： Showa Denko K.K. ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： ISHIUCHI, Ryujin ,  TAMURA, Akifumi ,  KANEOKA, Hidekazu ,  SUGITA, Hiroaki

IPC分类号： C08F283/01 ,  H02K3/30 ,  H02K5/08 ,  C08F299/04 ,  C08K5/14 ,  C08K3/00

CPC分类号： H02K3/30 ,  C08F299/0485 ,  C08J5/24 ,  C08J2367/06 ,  C08K3/22 ,  C08K5/098 ,  C08K5/13 ,  C08K5/14 ,  C08K7/14 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/014 ,  C08L25/06 ,  C08L33/12 ,  C08L67/06 ,  H02K5/08

摘要： Provided is an unsaturated polyester resin composition comprising 100 parts by mass of an unsaturated polyester resin (a) 400 to 1,000 parts by mass of a mixture of an inorganic filler (b) having a thermal conductivity coefficient of 20 W/m·K or more and aluminum hydroxide (c); 20 to 300 parts by mass of a glass fiber (d) having a fiber length of 1.5 mm or less; and 15 to 50 parts by mass of a low profile additive (e), the inorganic filler (b) and the aluminum hydroxide (c) being mixed at a mass ratio of 80:20 to 20:80, in which the unsaturated polyester resin composition further includes an alkyl peroxyalkylate-based curing agent (f) represented by the following formula (1): wherein R represents an alkyl group; and R' represents an alkyl group having 3 or more carbon atoms, and a polymerization inhibitor (g). The unsaturated polyester resin composition yields a cured product having a low shrinkage ratio, a low linear expansion coefficient, and a high thermal conductivity coefficient, and is excellent in in-mold flowability and curability.