公开(公告)号：EP3949778A1

公开(公告)日：2022-02-09

申请号：EP19926188.4

申请日：2019-11-21

Applicant: Showa Denko Materials Co., Ltd.

Inventor： QU Shujie ,  KOMIYA Souichirou ,  IMAI Takuya ,  MAGOME Kazuyuki ,  KAMEI Junichi

IPC: A41H43/04 ,  C09J175/04 ,  D06M15/572 ,  C08G18/10

Abstract: A moisture-curable hot-melt adhesive composition is disclosed. This moisture-curable hot-melt adhesive composition contains: a urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having two or more isocyanate groups; and a modified urethane prepolymer including a polymer chain, which includes a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and having one or more isocyanate groups modified with a castor oil monool.