公开(公告)号：EP1741010A2

公开(公告)日：2007-01-10

申请号：EP05725438.5

申请日：2005-03-11

申请人： Signature Control Systems Inc.

发明人： SCHNEIDER, Scott ,  MAGILL, Richard

IPC分类号： G05B19/18 ,  G05B15/02 ,  G05B13/02 ,  G06F19/00 ,  B29C39/00 ,  B29C45/00 ,  G06G7/66 ,  G01F7/00 ,  G01F17/00 ,  G01F23/00 ,  G01N37/00 ,  G04F1/00

CPC分类号： B29C35/0288 ,  G01N27/021 ,  G01N33/442

摘要： A process for curing a moldable compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a plurality of sensors distributed within a curing mold, wherein the moldable compound is a dialectric for each of the sensors; (2) determining impedance related measurements from the data streams for the plurality of sensors; (3) determining predictive and/or corrective curing actions for enhancing the curing process using the impedance related measurements for the plurality of sensors; and (4) controlling the mass production curing of parts to obtain cured parts having one or more desired properties.

公开(公告)号：EP1534494A1

公开(公告)日：2005-06-01

申请号：EP02807591.9

申请日：2002-10-09

申请人： Signature Control Systems Inc.

发明人： VAN DOREN, John, C. ,  MAGILL, Richard ,  SELLERS, Bruce ,  ERICKSON, Tim ,  SCHNEIDER, Scott ,  COURINGTON, Steve ,  BETHEL, Lance

IPC分类号： B29C65/00

CPC分类号： G01N33/445 ,  B29C35/0288 ,  B29D30/0601 ,  B29D2030/0677 ,  B29K2021/00 ,  B29L2030/00 ,  B29L2031/26 ,  B29L2031/265

摘要： The vulcanization rubber compound (6) in the injection mold (18) then beomces the dielectric within the formed capacitor, as it is sandwiched between the sensor (17) and the surface of the mold (18) or metallic insert within the part being molded (the opposing electrode). Since the dielectric properties of the rubber change as the rubber vulcanizes, the impedance of the formed capacitor changes as well, which allows for a non-invasive method of monitoring and controlling vulcanization in the mold (18).