公开(公告)号：EP2362418A2

公开(公告)日：2011-08-31

申请号：EP11150843.8

申请日：2011-01-13

Applicant: SiliconFile Technologies Inc.

Inventor： Lee, Byoung Su ,  Lee, Do Young

IPC: H01L27/146 ,  G01N21/00

CPC classification number: H01L27/14603 ,  G01N21/6454 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464

Abstract: A biochip (200) having an image sensor with a back side illumination photodiode structure includes: a biochip layer (200a); and an image sensor layer (200b) attached to one surface of the biochip layer and configured to sense light with biochemical reaction information, which is emitted from the biochip layer, wherein the image sensor layer includes a plurality of light sensing parts (PD1,PD2,PD3) which receive the light directed toward a back side of a wafer.

公开(公告)号：EP2362418A3

公开(公告)日：2012-07-25

申请号：EP11150843.8

申请日：2011-01-13

Applicant: SiliconFile Technologies Inc.

Inventor： Lee, Byoung Su ,  Lee, Do Young

IPC: H01L27/146 ,  G01N21/00 ,  G01N21/64

CPC classification number: H01L27/14603 ,  G01N21/6454 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464

Abstract: A biochip (200) having an image sensor with a back side illumination photodiode structure includes: a biochip layer (200a); and an image sensor layer (200b) attached to one surface of the biochip layer and configured to sense light with biochemical reaction information, which is emitted from the biochip layer, wherein the image sensor layer includes a plurality of light sensing parts (PD1,PD2,PD3) which receive the light directed toward a back side of a wafer.

Abstract translation: 具有背面照明光电二极管结构的图像传感器的生物芯片（200）包括：生物芯片层（200a）; 以及图像传感器层（200b），其附接到所述生物芯片层的一个表面，并且被配置为从所述生物芯片层发射的生化反应信息感测光，其中，所述图像传感器层包括多个光感测部（PD1，PD2 ，PD3），其接收指向晶片背面的光。