公开(公告)号：EP2648906A1

公开(公告)日：2013-10-16

申请号：EP11847549.0

申请日：2011-11-22

申请人： Skorpios Technologies, Inc.

发明人： DALLESASSE, John ,  KRASULICK, Stephen, B.

IPC分类号： B32B27/00 ,  B32B27/32 ,  H01L21/30

CPC分类号： H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

摘要： A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the SOI substrate and the assembly substrate, joining the SOI substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

公开(公告)号：EP2648906B1

公开(公告)日：2018-09-19

申请号：EP11847549.0

申请日：2011-11-22

申请人： Skorpios Technologies, Inc.

发明人： DALLESASSE, John ,  KRASULICK, Stephen, B.

IPC分类号： B32B27/00 ,  B32B27/32 ,  H01L21/30 ,  H01L25/16

CPC分类号： H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

摘要： A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the SOI substrate and the assembly substrate, joining the SOI substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.