专利检索 ap:("SnapTrack, Inc.") AND inv:"Gunji, Katsuhiko" 第 1 页

1.

发明授权
Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device 有权

公开(公告)号：EP1313214B1

公开(公告)日：2020-02-26

申请号：EP02025815.8

申请日：2002-11-18

申请人： SnapTrack, Inc.

发明人： Nakano, Masahiro , Gunji, Katsuhiko , Oikawa, Yasunobu , Sato, Katsuo

IPC分类号： H03H9/05 , H03H9/08 , H03H9/10