ENGINEERED SUBSTRATE
    4.
    发明公开

    公开(公告)号:EP3411898A1

    公开(公告)日:2018-12-12

    申请号:EP17703365.1

    申请日:2017-02-01

    申请人: Soitec

    摘要: Engineered substrate comprising: a seed layer made of a first semiconductor material for growth of a solar cell; a support substrate comprising a base and a surface layer epitaxially grown on a first side of the base, the base and the surface layer made of a second semiconductor material; a direct bonding interface between the seed layer and the surface layer; wherein doping concentration of the surface layer is higher than a predetermined value such that the electrical resistivity at the direct bonding interface is below 10 m Ohm·cm², preferentially below 1 m Ohm·cm²; and wherein doping concentration of the base as well as the thickness of the engineered substrate are such that absorption of the engineered substrate is less than 20%, preferentially less than 10%, and total area-normalized series resistance of the engineered substrate is less than 10 m Ohm·cm², preferentially less than m Ohm·cm². 1