公开(公告)号：EP4082771A1

公开(公告)日：2022-11-02

申请号：EP20905289.3

申请日：2020-11-19

申请人： Sumitomo Bakelite Co.Ltd.

发明人： OCHIAI, Yuki ,  MOCHIZUKI, Shunsuke ,  OKASAKA, Shu

IPC分类号： B32B15/08 ,  B32B27/42 ,  C08J7/048 ,  F16L9/147

摘要： A structure (piping part (121)) has a cured product of a thermosetting resin composition (resin molded body (101)) and a plating layer (103) formed on a surface of the cured product, in which the plating layer (103) has a Cu layer (second plating layer (107)) and a thickness of the Cu layer (second plating layer (107)) is 2 µm or more and 50 µm or less.

公开(公告)号：EP4011981A1

公开(公告)日：2022-06-15

申请号：EP20849301.5

申请日：2020-08-06

申请人： Sumitomo Bakelite Co.Ltd.

发明人： OCHIAI, Yuki ,  MOCHIZUKI, Shunsuke

IPC分类号： C08L101/00 ,  C08K7/14 ,  C08L51/04 ,  C08L61/06 ,  C23C18/32

摘要： A thermosetting resin composition used in a resin molded body for which a plating process is applied to a surface includes component (A), which is a thermosetting resin, and component (B), which is core-shell-type elastomer particles.

公开(公告)号：EP4011956A1

公开(公告)日：2022-06-15

申请号：EP20850826.7

申请日：2020-08-06

申请人： Sumitomo Bakelite Co.Ltd.

发明人： OCHIAI, Yuki ,  MOCHIZUKI, Shunsuke

IPC分类号： C08L9/00 ,  C08L29/14 ,  C08L61/06 ,  B32B15/098 ,  C08K3/26 ,  C23C18/22

摘要： A phenol resin composition used in a resin molded body for which a plating process is applied to a surface includes component (A), which is phenol resin and component (B), which is calcium carbonate.