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1.发明公开METHOD FOR FABRICATING MULTILAYER CIRCUIT BOARD, CIRCUIT PLATE, AND METHOD FOR FABRICATING THE CIRCUIT PLATE 审中-公开一种用于生产多层电路板，电路板及其制造方法电路板
公开(公告)号：EP1954112A1
公开(公告)日：2008-08-06
申请号：EP06822580.4
申请日：2006-10-30
IPC分类号： H05K3/46
CPC分类号： H05K3/4673 , H05K3/386 , H05K3/4617 , H05K3/4626 , H05K3/4647 , H05K2201/09881 , H05K2203/0264 , H05K2203/066 , H05K2203/1189
摘要： A method for fabricating a multilayer circuit board, including: preparing a film 1 with interlayer adhesive in which a first protective film 102 and a first interlayer adhesive 104 are stacked; preparing a first circuit board 2 having a first base 202 and a conductive post 204 protruding from the first base 202; stacking the surface of the first interlayer adhesive and the surface including the conductive post together; peeling off the first protective film 102; preparing a second circuit board 3 including a conductive pad 302 receiving the conductive post 204; and stacking and bonding the first circuit board 2 and the second circuit board 3 through the first interlayer adhesive 104 so that the conductive post 204 and the conductive pad 302 face each other, wherein in the peeling off, the first interlayer adhesive 104 at the top portion 206 of the conductive post is selectively removed while peeling off the first protective film 102.
摘要翻译： 一种制造多层电路板的方法，包括：准备膜1与其中的第一保护膜102和第一层间粘合剂片104层叠层间粘合剂; 制备具有第一基座202和导电柱204从第一基部202突出的第一电路基板2; 堆叠所述第一层间粘合剂的表面和该表面包括所述后导电在一起; 剥离所述第一保护膜102; 制备第二电路板3包括：接收导电柱204的导电焊盘302; 和堆叠并通过第一层间粘合剂104的第一电路板2和第二电路板3接合，从而DASS死导电柱204和导电焊盘302彼此面对，worin在剥落，在顶部的第一层间粘合剂104 导电柱的部分206可有选择地同时剥离所述第一保护膜除去第102
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