公开(公告)号：EP1180920B1

公开(公告)日：2013-11-27

申请号：EP01119121.0

申请日：2001-08-08

申请人： Panasonic Corporation

发明人： Takenaka, Toshiaki ,  Nishii, Toshihiro ,  Yamane, Shigeru ,  Nakamura, Shinji ,  Komoda, Hideaki ,  Kishimoto, Kunio

IPC分类号： H05K3/40 ,  H05K3/46

CPC分类号： H05K3/462 ,  H05K1/0268 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

公开(公告)号：EP1674230A4

公开(公告)日：2010-11-10

申请号：EP04788238

申请日：2004-09-28

申请人： SEKISUI CHEMICAL CO LTD

发明人： MATSUMOTO HIROTAKE

IPC分类号： B29C43/32 ,  B29C43/00 ,  B29C43/20 ,  B32B27/00 ,  B32B27/08 ,  H05K3/28 ,  H05K3/46

CPC分类号： H05K3/4673 ,  B29C43/003 ,  B29C2043/025 ,  B29K2105/256 ,  B29L2031/3425 ,  B32B5/142 ,  B32B7/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2307/306 ,  B32B2307/538 ,  B32B2307/546 ,  B32B2307/704 ,  B32B2307/716 ,  B32B2307/744 ,  B32B2457/08 ,  H05K3/281 ,  H05K2203/066

摘要： A multi-layer sheet which has a follow-up layer being composed of a resin composition containing a resin having a melting point, which is the melting peak temperature measured by DSC, in the range of 50 to 130 °C as a primary component, and a releasing layer being composed of a resin composition containing a resin having a melting point of 200 °C or higher as a primary component and being laminated on the above follow-up layer, wherein when the two releasing layers of the above multi-layer sheets are closely contacted with each other under a condition of 170 °C and 3 MPa for 30 minutes, they exhibit a blocking force of 0.1 N/cm or less as measured in accordance with ASTM D1893. The multi-layer sheet is excellent in heat resistance, releasing characteristics and follow-up characteristics to an irregular surface, exhibits excellent non-staining characteristics and also can be easily disposed of after use.

公开(公告)号：EP1798767A3

公开(公告)日：2010-04-21

申请号：EP07007228.5

申请日：2002-01-10

申请人： Panasonic Corporation

发明人： Okada, Kazuo ,  Hirano, Koichi, c/o Matsushita el. Ind. Co., Ltd. ,  Okawa, Takaaki ,  Tanaka, Shinya, c/o Matsushita El. Ind. Co., Ltd.

IPC分类号： H01L25/04 ,  H01L23/12 ,  H01L23/50 ,  H01L23/498 ,  H05K3/04 ,  H05K3/20

CPC分类号： H05K3/0061 ,  H01L23/49861 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K3/041 ,  H05K3/202 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2203/066 ,  H01L2924/00

摘要： A lead frame of a circuit board is punched in a direction opposite to a heat sink plate. Even if burrs are produced due to the punching, the burrs do not penetrate a sheet or short-circuit to the heat sink plate. A resist film tightly contacts on the periphery of a land of the lead frame of the circuit board, and a plated layer tightly contacts on the land. This prevents electronic components from defective mounting on the land.

公开(公告)号：EP2058903A1

公开(公告)日：2009-05-13

申请号：EP07791950.4

申请日：2007-08-03

申请人： Hitachi Chemical Company, Ltd.

发明人： TATSUZAWA, Takashi c/o Hitachi Chemical Company Ltd, ,  KOBAYASHI, Kouji c/o Hitachi Chemical Company Ltd., ,  UENO, Katsuyuki

IPC分类号： H01R11/01 ,  C09J7/02 ,  C09J9/02 ,  C09J201/00 ,  H01B5/16 ,  H01B13/00 ,  H01R43/00 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC分类号： H05K3/323 ,  C09J7/20 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/40 ,  H01L24/75 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/79 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H01R13/03 ,  H05K3/361 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/1189 ,  H01L2924/00

摘要： The anisotropic conductive tape (1) of the invention is used for electrical connection between opposing circuit electrodes and is provided with a tape-like base material (20) and with multiple adhesive layers (11b, 12b) formed in parallel on the main side of the base material (20) along the lengthwise direction of the base material (20), wherein at least two of the multiple adhesive layers have different structures.

摘要翻译： 本发明的各向异性导电带（1）被用于相对的电路电极之间的电连接，并且设置有一带状基体材料（20），并与平行形成在所述主侧的多个粘合剂层（11B，12B） 基底材料（20）沿着所述基材的长度方向（20）worin至少两个所述多个粘合层具有不同的结构。

公开(公告)号：EP1674905B1

公开(公告)日：2008-10-15

申请号：EP05257943.0

申请日：2005-12-21

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Shelnut, James G. ,  Moynihan, Matthew L. ,  Little, Luke W.

IPC分类号： G02B6/138

CPC分类号： G02B6/43 ,  B29D11/0073 ,  C08L83/04 ,  G02B6/10 ,  G02B6/138 ,  H05K1/0274 ,  H05K3/0023 ,  H05K2203/066 ,  C08L2666/28

公开(公告)号：EP1954112A1

公开(公告)日：2008-08-06

申请号：EP06822580.4

申请日：2006-10-30

申请人： Sumitomo Bakelite Company, Ltd.

发明人： KONDO, Masayoshi c/o Akita Sumitomo Bake Co. Ltd.

IPC分类号： H05K3/46

CPC分类号： H05K3/4673 ,  H05K3/386 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4647 ,  H05K2201/09881 ,  H05K2203/0264 ,  H05K2203/066 ,  H05K2203/1189

摘要： A method for fabricating a multilayer circuit board, including: preparing a film 1 with interlayer adhesive in which a first protective film 102 and a first interlayer adhesive 104 are stacked; preparing a first circuit board 2 having a first base 202 and a conductive post 204 protruding from the first base 202; stacking the surface of the first interlayer adhesive and the surface including the conductive post together; peeling off the first protective film 102; preparing a second circuit board 3 including a conductive pad 302 receiving the conductive post 204; and stacking and bonding the first circuit board 2 and the second circuit board 3 through the first interlayer adhesive 104 so that the conductive post 204 and the conductive pad 302 face each other, wherein in the peeling off, the first interlayer adhesive 104 at the top portion 206 of the conductive post is selectively removed while peeling off the first protective film 102.

摘要翻译： 一种制造多层电路板的方法，包括：准备膜1与其中的第一保护膜102和第一层间粘合剂片104层叠层间粘合剂; 制备具有第一基座202和导电柱204从第一基部202突出的第一电路基板2; 堆叠所述第一层间粘合剂的表面和该表面包括所述后导电在一起; 剥离所述第一保护膜102; 制备第二电路板3包括：接收导电柱204的导电焊盘302; 和堆叠并通过第一层间粘合剂104的第一电路板2和第二电路板3接合，从而DASS死导电柱204和导电焊盘302彼此面对，worin在剥落，在顶部的第一层间粘合剂104 导电柱的部分206可有选择地同时剥离所述第一保护膜除去第102

公开(公告)号：EP1276153A4

公开(公告)日：2005-05-25

申请号：EP02729533

申请日：2002-01-10

申请人： MATSUSHITA ELECTRIC IND CO LTD

发明人： SUZUMURA MASAKI ,  OKADA KAZUO ,  HIRANO KOICHI ,  OKAWA TAKAAKI ,  TANAKA SHINYA

IPC分类号： H01L23/498 ,  H01L23/538 ,  H05K3/00 ,  H05K3/04 ,  H05K3/20 ,  H05K3/28 ,  H01L25/04 ,  H01L23/12 ,  H01L23/50

CPC分类号： H05K3/0061 ,  H01L23/49861 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K3/041 ,  H05K3/202 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2203/066 ,  H01L2924/00

摘要： A lead frame on a circuit board is punched in a direction opposite to a radiation sheet, and burr, even if made by the punching, does not pass through a sheet to short-circuit the radiation sheet. A resist film is bonded to the land outer periphery of the lead frame of the circuit board, and plating film is bonded to the land surface to thereby prevent an incorrect mounting of electronic parts onto the land.

摘要翻译： 电路板上的引线框沿与辐射片相反的方向被冲压，并且即使通过冲压制成，毛刺也不会穿过片以使辐射片短路。 抗蚀剂膜粘合到电路板的引线框架的焊盘外围，并且电镀膜结合到焊盘表面，从而防止电子部件在焊盘上的不正确安装。

公开(公告)号：EP1425358A1

公开(公告)日：2004-06-09

申请号：EP02726922.4

申请日：2002-05-24

申请人： 3M Innovative Properties Company

发明人： YAMAGUCHI, Hiroaki ,  KITAMURA, Tetsu

IPC分类号： C09J5/06

CPC分类号： C09J5/06 ,  C08L63/00 ,  C09J2463/00 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0108 ,  H05K2203/0528 ,  H05K2203/066 ,  H05K2203/1121

摘要： The invention provides a method for adhering two substrates comprising: providing an adhesive film having a first surface and a second surface; irradiating the adhesive film with ultraviolet radiation to provide an activated adhesive film having a first activated surface and a second activated surface; cooling the activated adhesive film either while irradiating or immediately after irradiating the film; contacting the first activated surface with a first substrate; contacting the second activated surface with a second substrate; and applying heat and pressure to the first and second substrates to cure the activated adhesive film and to bond the substrates to one another.

公开(公告)号：EP1381261A2

公开(公告)日：2004-01-14

申请号：EP02256876.0

申请日：2002-10-03

申请人： Ultratera Corporation

发明人： Yu, Ching-I ,  Chih, Lang-Ching ,  Liu, Kang-Tsun ,  Yen, Kung-Ming

IPC分类号： H05K3/38 ,  H05K3/46 ,  H05K3/02

CPC分类号： H05K3/4673 ,  B32B37/12 ,  B32B2311/12 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0358 ,  H05K2203/0156 ,  H05K2203/066

摘要： A resin-coated carrier having a sheet-like base, the sheet-like base corresponding to the shape of a PC board substrate on a relatively smaller scale, and a resin of a predetermined thickness covered over one side of the sheet-like base for bonding to a PC board substrate for making a PC board without causing an overflow of the resin.

摘要翻译： 具有片状基材的树脂涂布载体，相当于相对较小规模的PC板基板的形状的片状基材和覆盖在片状基材一侧的预定厚度的树脂， 接合到用于制造PC板的PC板基板，而不会引起树脂溢出。

公开(公告)号：EP1093909B1

公开(公告)日：2003-10-15

申请号：EP00114514.3

申请日：2000-07-06

申请人： W.C. Heraeus GmbH & Co. KG

发明人： Herklotz, Günter, Dr. ,  Rabe, Michael

IPC分类号： B32B3/24 ,  B32B31/00 ,  G06K19/02 ,  H01L23/00 ,  H05K3/00 ,  H01L23/498 ,  H05K3/38

CPC分类号： B32B15/08 ,  B32B3/28 ,  B32B7/12 ,  B32B15/00 ,  B32B27/00 ,  B32B37/1207 ,  B32B2457/08 ,  H01L21/4857 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/0064 ,  H05K3/041 ,  H05K3/202 ,  H05K3/386 ,  H05K2203/063 ,  H05K2203/066 ,  H05K2203/1105 ,  H01L2924/00