摘要:
A method of manufacturing a group III-nitride crystal includes the steps of: preparing a seed crystal (10), and growing a first group III-nitride crystal (21) on the seed crystal (10) by liquid phase method; wherein in the step of growing a first group III-nitride crystal (21) on the seed crystal (10), rate of crystal growth V H in a direction parallel to a main surface (10h) of the seed crystal (10) is higher than rate of crystal growth V V in a direction vertical to the main surface (10h) of the seed crystal (10). By the manufacturing method, a group III-nitride crystal is obtained, of which dislocation density of a surface parallel to the main surface (10h) of the seed crystal (10) is as low as at most 5 × 10 6 /cm 2 .
摘要翻译:制备III族氮化物晶体的方法包括以下步骤:制备晶种(10),并通过液相法在晶种(10)上生长第一III族氮化物晶体(21); 其特征在于,在晶种(10)上生长第一III族氮化物晶体(21)的步骤中,与晶种(10)的主表面(10h)平行的方向的晶体生长速度V H高于 在垂直于晶种(10)的主表面(10h)的方向上的晶体生长速率V V。 通过该制造方法,得到与晶种(10)的主面(10h)平行的面的位错密度为5×10 6 / cm 2以下的III族氮化物晶体。
摘要:
A method of manufacturing group III-nitride semiconductor crystal includes the steps of accommodating an alloy (11) containing at least a group III-metal element and an alkali metal element in a reactor (1), introducing a nitrogen-containing substance (14) in the reactor (1), dissolving the nitrogen-containing substance (14) in an alloy melt (13) in which the alloy (11) has been melted, and growing group III-nitride semiconductor crystal (15) is provided. The group III-nitride semiconductor crystal (15) attaining a small absorption coefficient and an efficient method of manufacturing the same, as well as a group III-nitride semiconductor device attaining high light emission intensity can thus be provided.
摘要:
A method for producing a group III nitride crystal substrate comprising a step for introducing an alkali metal element-containing substance (1), a group III element-containing substance (2) and a nitrogen element-containing substance (3) into a reaction container (51), a step for forming a melt (5) containing at least an alkali metal element, group III element and nitrogen element in the reaction container (51), and a step for growing a group III nitride crystal (6) from the melt (5) is characterized in that the alkali metal element-containing substance (1) is handled within a dry container (100) wherein the moisture concentration is controlled to 1.0 ppm or less at least during the step wherein the alkali metal element-containing substance (1) is introduced into the reaction container (51). Consequently, there can be obtained a group III nitride crystal substrate having a small light absorption coefficient. Also disclosed is a group III nitride semiconductor device.
摘要:
Disclosed is a method for producing a group III nitride semiconductor crystal wherein an alloy (11) containing at least a group III metal element and an alkali metal element is put in a reaction container (1) and a nitrogen-containing substance (14) is introduced into the reaction container (1), so that the nitrogen-containing substance (14) is dissolved in an alloy melt (13) of the molten alloy (11) and there is grown a group III nitride semiconductor crystal (15). By this method, there can be efficiently obtained a group III nitride semiconductor crystal (15) having a low light absorption coefficient. Also disclosed is a group III nitride semiconductor device having a high luminous intensity.
摘要:
A method of manufacturing a group III-nitride crystal substrate including the steps of introducing an alkali-metal-element-containing substance (1), a group III-element-containing substance (2) and a nitrogen-element-containing substance (3) into a reactor (51), forming a melt (5) containing at least the alkali metal element, the group III-element and the nitrogen element in the reactor (51), and growing group III-nitride crystal (6) from the melt (5), and characterized by handling the alkali-metal-element-containing substance (1) in a drying container (100) in which moisture concentration is controlled to at most 1.0ppm at least in the step of introducing the alkali-metal-element-containing substance (1) into the reactor (51) is provided. A group III-nitride crystal substrate attaining a small absorption coefficient and the method of manufacturing the same, as well as a group III-nitride semiconductor device can thus be provided.