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公开(公告)号：EP4026648A1
公开(公告)日：2022-07-13
申请号：EP22152391.3
申请日：2018-03-12
发明人： TANAKA, Teppei , AIZAWA, Satoshi , AIBA, Takeshi
IPC分类号： B23K26/00 , H01L21/268 , B23K26/03 , B23K26/082 , B23K26/352 , B23K101/40 , B23K103/00
摘要： There is provided a laser machining device (101) which can realize an easy and proper inspection for an object used in laser machining work. The laser machining device (101) includes heat radiation measurement unit (126) that measures intensity of heat radiation of a workpiece (141) irradiated with a laser beam, and a determination unit (111) that determines a state of a target (141) by defining an object used in the machining work as the target (141), based on the intensity of the heat radiation measured by the heat radiation measurement unit (126).
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公开(公告)号：EP3451370A1
公开(公告)日：2019-03-06
申请号：EP18189849.5
申请日：2018-08-21
发明人： TANAKA, Teppei
摘要： Provided is a laser annealing apparatus capable of reducing time and labor for measuring a sheet resistance and measuring the sheet resistance in a non-contact manner. A laser beam from a laser optical system is incident onto a semiconductor wafer. Thermal radiation light from the semiconductor wafer is incident onto an infrared detector. The infrared detector outputs a signal based on the intensity of the thermal radiation light. A processing device calculates a sheet resistance of the semiconductor wafer that is annealed by the laser beam on the basis of an output value of the infrared detector, and outputs a calculation value of the sheet resistance to an output device.
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公开(公告)号：EP4026647A1
公开(公告)日：2022-07-13
申请号：EP22152385.5
申请日：2018-03-12
发明人： TANAKA, Teppei , AIZAWA, Satoshi , AIBA, Takeshi
IPC分类号： B23K26/00 , H01L21/268 , B23K26/03 , B23K26/082 , B23K26/352 , B23K101/40 , B23K103/00
摘要： There is provided a laser machining device (101) which can realize an easy and proper inspection for an object used in laser machining work. The laser machining device (101) includes heat radiation measurement unit (126) that measures intensity of heat radiation of a workpiece (141) irradiated with a laser beam, and a determination unit (111) that determines a state of a target by defining an object used in the machining work as the target, based on the intensity of the heat radiation measured by the heat radiation measurement unit (126).
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公开(公告)号：EP3893269A1
公开(公告)日：2021-10-13
申请号：EP19893052.1
申请日：2019-11-20
发明人： TANAKA, Teppei
IPC分类号： H01L21/265 , H01L21/268
摘要： A heating unit heats a surface of an annealing object to temporarily melt an outer layer portion. A sensor detects thermal radiation light from the annealing object heated by the heating unit. A processing unit estimates an annealing result of the annealing object on the basis of a waveform showing a temporal change in an intensity of the thermal radiation light detected by the sensor.
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公开(公告)号：EP4131340A1
公开(公告)日：2023-02-08
申请号：EP21777149.2
申请日：2021-02-25
发明人： TANAKA, Teppei
IPC分类号： H01L21/265 , H01L21/268 , G01J5/00
摘要： A photodetector separately measures intensities of radiant light from a semiconductor member being annealed, in a plurality of wavelength ranges that are different from each other. A processing device obtains a physical quantity related to the semiconductor member that changes due to annealing, based on the intensities in the plurality of wavelength ranges measured by the photodetector. It becomes possible to measure the physical quantity related to the semiconductor member that changes due to annealing without damaging the semiconductor member.
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公开(公告)号：EP3597351A1
公开(公告)日：2020-01-22
申请号：EP18767578.0
申请日：2018-03-12
发明人： TANAKA, Teppei , AIZAWA, Satoshi , AIBA, Takeshi
IPC分类号： B23K26/00 , H01L21/268
摘要： There is provided a laser machining device (101) which can realize an easy and proper inspection for an object used in laser machining work. The laser machining device (101) includes heat radiation measurement unit (126) that measures intensity of heat radiation of a workpiece irradiated with a laser beam, and a determination unit (11) that determines a state of a target (41) by defining an object used in the machining work as the target (41), based on the intensity of the heat radiation measured by the heat radiation measurement unit (126).
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公开(公告)号：EP3726564A1
公开(公告)日：2020-10-21
申请号：EP18887501.7
申请日：2018-11-16
发明人： TANAKA, Teppei
IPC分类号： H01L21/268 , H01L21/683
摘要： A chuck plate is disposed between an annealing object and a holding table. The chuck plate has a function of attenuating thermal radiation light radiated from the annealing object and directed toward the holding table. The use of the chuck plate makes it possible to increase the accuracy of temperature measured by detection of thermal radiation light.
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