公开(公告)号：EP2752443B1

公开(公告)日：2018-05-16

申请号：EP12826958.6

申请日：2012-08-21

申请人： Sumitomo Seika Chemicals Co., Ltd. ,  National Institute of Advanced Industrial Science and Technology

发明人： BANDO, Seiji ,  MISHO, Daisuke ,  KAWASAKI, Kazunori ,  EBINA, Takeo ,  HAYASHI, Hiromichi ,  NAKAMURA, Takashi ,  YOSHIDA, Manabu

IPC分类号： C08J5/18 ,  H01L31/042 ,  C08L79/08 ,  C08K3/34

CPC分类号： H01L31/18 ,  C08G73/14 ,  C08J3/215 ,  C08J5/18 ,  C08J2379/08 ,  C08K3/346 ,  H01L31/049 ,  Y02E10/50 ,  C08L79/08

摘要： An object of the present invention is to provide a water vapor barrier film having good flexibility, good moisture resistance, and high mechanical strength. A further object of the present invention is to provide a dispersion for water vapor barrier films which is intended to be used to produce the water vapor barrier film, a method for producing the water vapor barrier film, a solar cell back sheet incorporating the water vapor barrier film, and a solar cell incorporating the water vapor barrier film or the solar cell back sheet. The present invention provided a water vapor barrier film containing: phyllosilicate mineral; and a synthetic resin, wherein the phyllosilicate mineral includes a non-swelling clay mineral and a swelling clay mineral, the phyllosilicate mineral is present in an amount of not less than 30% by weight and not more than 90% by weight of the total weight of the water vapor barrier film, and the water vapor barrier film has a water vapor permeability, measured at 40°C and 90%RH, of not more than 0.5 g/m 2 ·day.

公开(公告)号：EP4061102A1

公开(公告)日：2022-09-21

申请号：EP20886649.1

申请日：2020-11-10

申请人： National Institute Of Advanced Industrial Science and Technology

发明人： KANAZAWA, Kenji ,  UEMURA, Sei ,  NISHIOKA, Masateru ,  NAKAMURA, Takashi

IPC分类号： H05K3/34 ,  H05B6/74 ,  H05B6/80 ,  H05K1/18

摘要： A mounting wiring board, containing a base, an electrode portion disposed on the base, and a heat generation pattern disposed on the electrode portion and to be heated by a standing wave of a microwave, in which an occupation area of the heat generation pattern is smaller than an area of an upper surface of the electrode portion;
an electronic device mounting board using the mounting wiring board;
a method of mounting the electronic device;
a microwave heating method, which contains heating an object to be heated provided via the heat generation pattern; and
a microwave heating apparatus.