CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING APPARATUS FOR THE CONDUCTIVE PATTERN FORMING FILM

    公开(公告)号:EP2075802A1

    公开(公告)日:2009-07-01

    申请号:EP07829964.1

    申请日:2007-10-17

    IPC分类号: H01B5/14 H01B13/00

    摘要: The present invention forms a conductive pattern using a simple process on a general plastic substrate having flexibility, and also provides a conductive pattern forming film that allows for easy formation of a conductive pattern using an apparatus that performs a simple process of oriented pressurization at low temperature, as well as a method for forming conductive pattern and a conductive pattern forming apparatus for the same.
    The conductive pattern forming film provides a pattern formed on a film substrate having flexibility by pressurizing, under heating, a conductive paste in which powder or fine particles of metal or semiconductor are dispersed and filled. The conductive pattern forming apparatus comprises a sample installation table having a flat placement surface, and a driving body for pressure application which is placed in a manner facing the placement surface and movable, wherein the driving body for pressure application is equipped with a support which is constituted by a flat metal panel having metal spheres along its bottom face.

    摘要翻译: 本发明形成上使用具有一般的塑料基板灵活性一个简单的过程的导电图案,并且因此提供的导电图案的成膜做允许容易地形成使用的装置做了导电图案的在低温下进行定向加压的一个简单的过程 ,以及用于形成导电图案和对于相同的导电图案形成装置的方法。 导电图案成膜提供形成在通过加压具有柔性的薄膜基板的图案,在加热下,将导电糊在哪个粉末或金属或半导体的微粒子分散和填充。 导体图案形成设备包括:具有平坦载置面,其在面向所述放置表面和可动的方式放置,worin驱动体为压力施加配备有支持所有这是一个样本安装表,和用于在压力施加驱动主体的所有 由具有沿其底面金属球扁平的金属板构成。

    CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD
    5.
    发明授权
    CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD 有权
    膜形成导电结构,形成导电结构的方法

    公开(公告)号:EP2075802B1

    公开(公告)日:2013-11-20

    申请号:EP07829964.1

    申请日:2007-10-17

    IPC分类号: H05K1/03 H05K3/10 H05K3/12

    摘要: The present invention forms a conductive pattern using a simple process on a general plastic substrate having flexibility, and also provides a conductive pattern forming film that allows for easy formation of a conductive pattern using an apparatus that performs a simple process of oriented pressurization at low temperature, as well as a method for forming conductive pattern and a conductive pattern forming apparatus for the same. The conductive pattern forming film provides a pattern formed on a film substrate having flexibility by pressurizing, under heating, a conductive paste in which powder or fine particles of metal or semiconductor are dispersed and filled. The conductive pattern forming apparatus comprises a sample installation table having a flat placement surface, and a driving body for pressure application which is placed in a manner facing the placement surface and movable, wherein the driving body for pressure application is equipped with a support which is constituted by a flat metal panel having metal spheres along its bottom face.